Electroplating High Aspect Ratio Through Holes in Thick Printed Circuit Boards

1990 ◽  
Vol 68 (2) ◽  
pp. 50-54 ◽  
Author(s):  
G. L. Fisher ◽  
W. Sonnenberg ◽  
J. Bladon ◽  
R. Bernards
1995 ◽  
Vol 61 (1) ◽  
pp. 80-84
Author(s):  
Yasuhiko HARA ◽  
Kiyoshi NUMATA ◽  
Satoru SHINADA ◽  
Ryuichi INOUE ◽  
Hiroshi IWATA

2020 ◽  
Vol 33 (2) ◽  
pp. 14-21
Author(s):  
Carmichael Gugliotti ◽  
Rich Bellemare ◽  
Andy Oh ◽  
Ron Blake

ABSTRACT Pulse plating of copper has typically found use in the plating of very difficult, high aspect ratio printed circuit boards. Its ability to provide throwing power deep within through holes with aspect ratios as high as 30:1 is well established. This technology has long been thought of as a high technology, high cost, specialty process applicable only to high end products. This paper will discuss the advantages that pulse plating offers over conventional DC copper plating in high volume production applications for panels with aspect ratios of up to 12:1. These advantages are reduced plating time, increased throughput, and reduced plated copper thickness on the panel surface while meeting minimum in-hole copper thickness requirements.  


2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara

Sign in / Sign up

Export Citation Format

Share Document