scholarly journals Periodic Pulse Plating of Mid-Aspect Ratio Printed Circuit Boards for Enhanced Productivity

2020 ◽  
Vol 33 (2) ◽  
pp. 14-21
Author(s):  
Carmichael Gugliotti ◽  
Rich Bellemare ◽  
Andy Oh ◽  
Ron Blake
Keyword(s):  
Aspect Ratio ◽  
Printed Circuit Boards ◽  
High Volume ◽  
Pulse Plating ◽  
Circuit Boards ◽  
Throwing Power ◽  
Printed Circuit ◽  
Aspect Ratios ◽  
High Volume Production ◽  
Volume Production

ABSTRACT Pulse plating of copper has typically found use in the plating of very difficult, high aspect ratio printed circuit boards. Its ability to provide throwing power deep within through holes with aspect ratios as high as 30:1 is well established. This technology has long been thought of as a high technology, high cost, specialty process applicable only to high end products. This paper will discuss the advantages that pulse plating offers over conventional DC copper plating in high volume production applications for panels with aspect ratios of up to 12:1. These advantages are reduced plating time, increased throughput, and reduced plated copper thickness on the panel surface while meeting minimum in-hole copper thickness requirements.  

scholarly journals Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 Composite

2020 ◽  
Vol 10 (15) ◽  
pp. 5197
Author(s):  
Sufyan A. Azam ◽  
Alex Fragoso
Keyword(s):  
Printed Circuit Boards ◽  
Copper Films ◽  
Circuit Boards ◽  
Good Correspondence ◽  
Printed Circuit ◽  
Modal Properties ◽  
Aspect Ratios ◽  
Different Diameters ◽  
First Time ◽  
Bare Copper

Printed circuit boards constitute the basis of most electronic devices and are mainly fabricated of thin copper films bounded to fiber epoxy laminates, such as FR4. Vibrational stress can induce device failure, and hence, studies addressing their modal properties have important applications. In this paper, cantilever samples made of bare copper bounded to FR4 have been studied to analyze, for the first time, the vibration behavior of specimens with different aspect ratios, with and without central holes of different diameters. Natural frequencies and damping ratios were determined experimentally and analytically using a finite element method for four groups of samples with a very good correspondence between both methods. The fundamental resonance frequency of all the specimens was found to be less than 40 Hz and the influence of a central hole was not significant to affect the modal properties.

Electroplating High Aspect Ratio Through Holes in Thick Printed Circuit Boards

1990 ◽  
Vol 68 (2) ◽  
pp. 50-54 ◽  
Author(s):  
G. L. Fisher ◽  
W. Sonnenberg ◽  
J. Bladon ◽  
R. Bernards
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit

Analysis of PCB via for Signal Integrity Using ANOVA

2013 ◽  
Vol 446-447 ◽  
pp. 956-960
Author(s):  
Shi Lei Zhou ◽  
Ya Lin Guan ◽  
Xin Kun Tang
Keyword(s):  
Printed Circuit Boards ◽  
Signal Integrity ◽  
Point Of View ◽  
Electromagnetic Simulation ◽  
Physical Aspect ◽  
Circuit Boards ◽  
Anova Analysis ◽  
Printed Circuit ◽  
Full Wave ◽  
Aspect Ratios

This paper based on ANOVA (ANalysis Of VAriance) presents an investigation in the design of signal via in multilayered printed circuit boards (PCB) technology from a signal integrity point of view. Using the concept of the orthogonal array (OA), different vias physical aspect ratios have been set in the analysis. The impacts of these parameters are investigated with the help for a full-wave electromagnetic simulation soft HFSS. This study demonstrates the factors which is the most influence on the signal integrity.

A Study of Primary Factors Influencing the Properties of Plating Throwing Power for Printed Circuit Boards

2013 ◽  
Vol 721 ◽  
pp. 409-413
Author(s):  
Yuanming Chen ◽  
Yuang Ming Chen ◽  
Shou Xu Wang ◽  
Wei He ◽  
Jia Zhang
Keyword(s):  
Current Density ◽  
Vibration Frequency ◽  
Printed Circuit Boards ◽  
Organic Additive ◽  
Orthogonal Experimental Design ◽  
Circuit Boards ◽  
Throwing Power ◽  
Printed Circuit ◽  
Copper Electroplating ◽  
Ic Packaging

High throwing power (TP) copper electroplating has become increasingly important for interconnect fabrication in IC packaging substrates and printed circuit boards (PCB) due to the demands of electronic products with high-density interconnection (HDI). In this study, the factors that influence throwing power of PCB such as plating liquid concentration, current density, organic additive composition and vibration frequency have been investigated. The results showed that, within the scope of this study, with the increase of the current density, PCB throwing power ability decreased gradually, descending grade range up to 5%. Throwing power ability gradually increased as different vibration frequency from 10s to 30s. The orthogonal experimental design was employed to investigate key factors out of all available operation parameters to influence TP. It turned out that the copper sulfate concentration of 30g/L, a current density of 5 ASF, a brightener concentration of 60ml/ kAH and the vibration frequency of 30s are advantageous to achieve best throwing power in the electrodeposition processes.

scholarly journals System for Inspecting Defects on the Inner Wall of High-aspect-ratio Through-holes in Printed Circuit Boards.

1995 ◽  
Vol 61 (1) ◽  
pp. 80-84
Author(s):  
Yasuhiko HARA ◽  
Kiyoshi NUMATA ◽  
Satoru SHINADA ◽  
Ryuichi INOUE ◽  
Hiroshi IWATA
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit
Sign in / Sign up

Export Citation Format

Share Document