Studies of copper deposition for high aspect ratio printed circuit boards

1989 ◽  
Vol 67 (1) ◽  
pp. 57-62 ◽  
Author(s):  
M. Goodenough ◽  
K. J. Whitlaw
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Printed Circuit Boards ◽  
Copper Deposition ◽  
Circuit Boards ◽  
Printed Circuit

Electroplating High Aspect Ratio Through Holes in Thick Printed Circuit Boards

1990 ◽  
Vol 68 (2) ◽  
pp. 50-54 ◽  
Author(s):  
G. L. Fisher ◽  
W. Sonnenberg ◽  
J. Bladon ◽  
R. Bernards
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit

scholarly journals System for Inspecting Defects on the Inner Wall of High-aspect-ratio Through-holes in Printed Circuit Boards.

1995 ◽  
Vol 61 (1) ◽  
pp. 80-84
Author(s):  
Yasuhiko HARA ◽  
Kiyoshi NUMATA ◽  
Satoru SHINADA ◽  
Ryuichi INOUE ◽  
Hiroshi IWATA
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit

scholarly journals Periodic Pulse Plating of Mid-Aspect Ratio Printed Circuit Boards for Enhanced Productivity

2020 ◽  
Vol 33 (2) ◽  
pp. 14-21
Author(s):  
Carmichael Gugliotti ◽  
Rich Bellemare ◽  
Andy Oh ◽  
Ron Blake
Keyword(s):  
Aspect Ratio ◽  
Printed Circuit Boards ◽  
High Volume ◽  
Pulse Plating ◽  
Circuit Boards ◽  
Throwing Power ◽  
Printed Circuit ◽  
Aspect Ratios ◽  
High Volume Production ◽  
Volume Production

ABSTRACT Pulse plating of copper has typically found use in the plating of very difficult, high aspect ratio printed circuit boards. Its ability to provide throwing power deep within through holes with aspect ratios as high as 30:1 is well established. This technology has long been thought of as a high technology, high cost, specialty process applicable only to high end products. This paper will discuss the advantages that pulse plating offers over conventional DC copper plating in high volume production applications for panels with aspect ratios of up to 12:1. These advantages are reduced plating time, increased throughput, and reduced plated copper thickness on the panel surface while meeting minimum in-hole copper thickness requirements.  

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