Lifetime calculation of adhesively bonded joints under proportional and non-proportional multiaxial fatigue loading: a combined critical plane and critical distance approach

2021 ◽  
pp. 1-30
Author(s):  
P.H.E. Fernandes ◽  
L. Poggenburg-Harrach ◽  
C. Nagel ◽  
V.C. Beber
Keyword(s):  
Fatigue Loading ◽  
Critical Distance ◽  
Multiaxial Fatigue ◽  
Bonded Joints ◽  
Critical Plane ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints ◽  
Distance Approach

Integrity monitoring of adhesively bonded joints via an electromechanical impedance-based approach

2017 ◽  
Vol 17 (5) ◽  
pp. 1031-1045 ◽  
Author(s):  
Yitao Zhuang ◽  
Fotis Kopsaftopoulos ◽  
Roberto Dugnani ◽  
Fu-Kuo Chang
Keyword(s):  
Fatigue Loading ◽  
Mechanical Tests ◽  
Lap Joints ◽  
Piezoelectric Sensors ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Monitoring Method ◽  
Integrity Monitoring ◽  
Adhesively Bonded Joints ◽  
Electromechanical Impedance

Monitoring the bondline integrity of adhesively bonded joints is one of the most critical concerns in the design of aircraft structures to date. Due to the lack of confidence on the integrity of the bondline both during fabrication and service, the industry standards and regulations require assembling the primary airframe structure using the inefficient “black-aluminum” approach, that is, drill holes and use fasteners. Furthermore, state-of-the-art non-destructive evaluation and structural health monitoring approaches are not yet able to provide mature solutions on the issue of bondline integrity monitoring. Therefore, the objective of this work is the introduction and feasibility investigation of a novel bondline integrity monitoring method that is based on the use of piezoelectric sensors embedded inside adhesively bonded joints in order to provide an early detection of bondline degradation. The proposed approach incorporates (1) micro-sensors embedded inside the adhesive layer leaving a minimal footprint on the material, (2) numerical and analytical modeling of the electromechanical impedance of the adhesive bondline, and (3) electromechanical impedance–based diagnostic algorithms for monitoring and assessing the bondline integrity. The experimental validation and assessment of the proposed approach is achieved via the design and fabrication of prototype adhesively bonded lap joints with embedded piezoelectric sensors and a series of mechanical tests under various static and dynamic (fatigue) loading conditions. The obtained results demonstrate the potential of the proposed approach in providing increased confidence on the use of adhesively bonded joints for aerospace structures.

Crack growth in adhesively bonded joints subjected to variable frequency fatigue loading

2003 ◽  
Vol 79 (12) ◽  
pp. 1161-1182 ◽  
Author(s):  
A. H. Al-Ghamdi ◽  
I. A. Ashcroft ◽  
A. D. Crocombe ◽  
M. M. Abdel-Wahab
Keyword(s):  
Crack Growth ◽  
Fatigue Loading ◽  
Variable Frequency ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints

Nonlinear Viscoelastic Finite Element Analysis of Adhesive Joints

1988 ◽  
Vol 16 (3) ◽  
pp. 146-170 ◽  
Author(s):  
S. Roy ◽  
J. N. Reddy
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Viscoelastic Behavior ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Element Analysis ◽  
Adhesively Bonded Joints ◽  
Nonlinear Viscoelastic ◽  
Structural Failures ◽  
Updated Lagrangian

Abstract A good understanding of the process of adhesion from the mechanics viewpoint and the predictive capability for structural failures associated with adhesively bonded joints require a realistic modeling (both constitutive and kinematic) of the constituent materials. The present investigation deals with the development of an Updated Lagrangian formulation and the associated finite element analysis of adhesively bonded joints. The formulation accounts for the geometric nonlinearity of the adherends and the nonlinear viscoelastic behavior of the adhesive. Sample numerical problems are presented to show the stress and strain distributions in bonded joints.

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