Recovery of edge-defined film-fed grown silicon Dislocation/twin boundary interaction and mechanisms for twin-induced grain boundary formation

1985 ◽  
Vol 51 (3) ◽  
pp. 449-467 ◽  
Author(s):  
R. Gdeichmann ◽  
M. D. Vaudin ◽  
D. G. Ast
Keyword(s):  
Grain Boundary ◽  
Twin Boundary ◽  
Boundary Formation ◽  
Boundary Interaction

In situ observation of multiple parallel (1 1 1) twin boundary formation from step-like grain boundary during Si solidification

2020 ◽  
Vol 13 (10) ◽  
pp. 105501
Author(s):  
Kuan-Kan Hu ◽  
Kensaku Maeda ◽  
Keiji Shiga ◽  
Haruhiko Morito ◽  
Kozo Fujiwara
Keyword(s):  
Grain Boundary ◽  
Twin Boundary ◽  
In Situ Observation ◽  
Boundary Formation

scholarly journals Twin boundary formation at a grain-boundary groove during the directional solidification of InSb

2022 ◽  
Vol 577 ◽  
pp. 126403
Author(s):  
Keiji Shiga ◽  
Atsuko Takahashi ◽  
Lu-Chung Chuang ◽  
Kensaku Maeda ◽  
Haruhiko Morito ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Directional Solidification ◽  
Twin Boundary ◽  
Boundary Groove ◽  
Boundary Formation

{10-12} Twinning Mechanism During In Situ Micro-Tensile Loading of Pure Mg: Role of Basal Slip and Twin-Twin Boundary Interaction

2020 ◽  
Author(s):  
Nicolò Maria della Ventura ◽  
Szilvia Kalácska ◽  
Daniele Casari ◽  
Thomas Edward James Edwards ◽  
Johann Michler ◽  
...  
Keyword(s):  
Twin Boundary ◽  
Basal Slip ◽  
Tensile Loading ◽  
Boundary Interaction

Twin-boundary formation in Japan-law twinned quartz crystals

2012 ◽  
Vol 24 (3) ◽  
pp. 509-517 ◽  
Author(s):  
Alenka Lenart ◽  
Zoran Samardžija ◽  
Matjaž Godec ◽  
Breda Mirtič ◽  
Sašo Šturm
Keyword(s):  
Twin Boundary ◽  
Quartz Crystals ◽  
Boundary Formation

The Stepwise Cross-sectional Crystalline Analysis of the Stress Induced Voiding in Cu Interconnect

2006 ◽  
Vol 914 ◽  
Author(s):  
Hyo-Jong Lee ◽  
Heung Nam Han ◽  
Suk Hoon Kang ◽  
Jeong-Yun Sun ◽  
Kyu Hwan Oh
Keyword(s):  
Grain Boundary ◽  
Twin Boundary ◽  
Triple Junction ◽  
Hydrostatic Stress ◽  
Electron Backscattered Diffraction ◽  
Cross Sectional ◽  
Copper Interconnect ◽  
Crystallographic Study ◽  
Cu Interconnect ◽  
Planar Electron

AbstractIn a crystallographic study of stress induced voiding of copper interconnect, the planar electron backscattered diffraction analysis showed that the void was initiated at the triple junction of the grain boundaries, not at the junction of the twin boundary and grain boundary. By using stepwise cross-sectional crystalline investigation for the void, it was possible to rebuild 3D crystalline structure near the void. From the stress calculation based on the measured crystalline structures, the hydrostatic stress was highly concentrated at the triple junction of the twin boundary and grain boundary, but experimentally, there was no voiding at that. The voiding in the copper interconnect may depend mainly on the boundary instability.

scholarly journals Phase evolution during lithium–indium halide superionic conductor dehydration

2021 ◽  
Author(s):  
Robert L. Sacci ◽  
Tyler H. Bennett ◽  
Andrew R. Drews ◽  
Venkataramani Anandan ◽  
Melanie J. Kirkham ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Neutron Scattering ◽  
Phase Evolution ◽  
Superionic Conductor ◽  
Boundary Formation

We follow the phase evolution during Li3InCl6 dehydration using a thermogravimetric, spectroscopic, XRD and neutron scattering approach. H2O removal allows Li to organize between InCl6 octahedral layers, and eventually leads to strain and grain boundary formation.

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