Thermal deformation measurement of flip-chip substrate using digital image correlation method

2012 ◽  
Vol 35 (7) ◽  
pp. 879-886
Author(s):  
Ming Chang ◽  
Wei-En Tsai ◽  
Sthefanus G. Witjaksana
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Thermal Deformation ◽  
Flip Chip ◽  
Correlation Method ◽  
Deformation Measurement ◽  
Image Correlation ◽  
Digital Image Correlation Method

scholarly journals Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method

2013 ◽  
Vol 53 (1) ◽  
pp. 145-153 ◽  
Author(s):  
Toru Ikeda ◽  
Toshifumi Kanno ◽  
Nobuyuki Shishido ◽  
Noriyuki Miyazaki ◽  
Hiroyuki Tanaka ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Flip Chip ◽  
Correlation Method ◽  
Image Correlation ◽  
Digital Image Correlation Method ◽  
Non Linear

Initial Value Estimation of Digital Image Correlation Method in Deformation Measurement Based on Feature Matching

2020 ◽  
Vol 57 (18) ◽  
pp. 181012
Author(s):  
朱天天 Zhu Tiantian ◽  
付中男 Fu Zhongnan ◽  
张梅 Zhang Mei ◽  
叶沛 Ye Pei ◽  
李桂华 Li Guihua
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Feature Matching ◽  
Correlation Method ◽  
Deformation Measurement ◽  
Image Correlation ◽  
Initial Value ◽  
Digital Image Correlation Method ◽  
Value Estimation
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