J0103-2-3 Evaluation of Thermal Fatigue Reliability of Solder Joints in Flip Chip Package using the Digital Image Correlation Method

2009 ◽  
Vol 2009.6 (0) ◽  
pp. 57-58
Author(s):  
Toshifumi KANNO ◽  
Nobuyuki SHISHIDO ◽  
Toru IKEDA ◽  
Noriyuki MIYAZAKI ◽  
Hiroyuki TANAKA ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Thermal Fatigue ◽  
Digital Image ◽  
Flip Chip ◽  
Solder Joints ◽  
Correlation Method ◽  
Image Correlation ◽  
Fatigue Reliability ◽  
Digital Image Correlation Method ◽  
Reliability Of Solder Joints

scholarly journals Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method

2013 ◽  
Vol 53 (1) ◽  
pp. 145-153 ◽  
Author(s):  
Toru Ikeda ◽  
Toshifumi Kanno ◽  
Nobuyuki Shishido ◽  
Noriyuki Miyazaki ◽  
Hiroyuki Tanaka ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Flip Chip ◽  
Correlation Method ◽  
Image Correlation ◽  
Digital Image Correlation Method ◽  
Non Linear

High-speed digital-image correlation method

2009 ◽  
Vol 34 (13) ◽  
pp. 1955 ◽  
Author(s):  
Min Wang ◽  
Hao Wang ◽  
Yuwan Cen
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
High Speed ◽  
Correlation Method ◽  
Image Correlation ◽  
Digital Image Correlation Method
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