The characterization of laser-induced thermal damage mechanism of mid-infrared optical coatings with surface contaminants

2020 ◽  
Vol 95 (3) ◽  
pp. 035507 ◽  
Author(s):  
Zhaokai Lou ◽  
Kai Han ◽  
Chaofan Zhang ◽  
Minsun Chen ◽  
Baozhu Yan ◽  
...  
2014 ◽  
Vol 1038 ◽  
pp. 75-81
Author(s):  
Bernd Niese ◽  
Philipp Amend ◽  
Uwe Urmoneit ◽  
Stephan Roth ◽  
Michael Schmidt

Embedding stereolithography (eSLA) is an additive, hybrid process, which provides a flexible production of 3D components and the ability to integrate electrical and optical conductive structures and functional components within parts. However, the embedding of conductive circuits in stereolithography (SLA) parts assumes usage of process technologies, which enables their direct integration of conductive circuits during the layer-wise building process. In this context, a promising method for in-situ generation of conductive circuits is dispensing of conductive adhesive on the current surface of the SLA part and its subsequent sintering. In this paper, the laser sintering (λ = 355 nm) of conductive adhesive mainly consisting of silver nanoparticles is investigated. The work intends to evaluate the curing behavior of the conductive adhesive, the beam-matter-interactions and the thermal damage of the SLA substrate. The investigations revealed a fast and flexible laser sintering process for the generation of conductive circuits with sufficient electrical conductivity and sufficient current capacity load. In this context, a characterization of the conductive structures is done by measuring their electrical resistance and their potential current capacity load.


2008 ◽  
Vol 310 (7-9) ◽  
pp. 2015-2019 ◽  
Author(s):  
P. Amedzake ◽  
E. Brown ◽  
U. Hömmerich ◽  
S.B. Trivedi ◽  
J.M. Zavada

2008 ◽  
Author(s):  
A. K. Mainzer ◽  
Henry Hogue ◽  
Maryn Stapelbroek ◽  
Dale Molyneux ◽  
John Hong ◽  
...  

1983 ◽  
Vol 22 (12) ◽  
pp. 1837 ◽  
Author(s):  
W. T. Pawlewicz ◽  
G. J. Exarhos ◽  
W. E. Conaway

Nanophotonics ◽  
2014 ◽  
Vol 3 (4-5) ◽  
pp. 329-341 ◽  
Author(s):  
Raji Shankar ◽  
Marko Lončar

AbstractThe mid-infrared (IR) wavelength region (2–20 µm) is of great interest for a number of applications, including trace gas sensing, thermal imaging, and free-space communications. Recently, there has been significant progress in developing a mid-IR photonics platform in Si, which is highly transparent in the mid-IR, due to the ease of fabrication and CMOS compatibility provided by the Si platform. Here, we discuss our group’s recent contributions to the field of silicon-based mid-IR photonics, including photonic crystal cavities in a Si membrane platform and grating-coupled high-quality factor ring resonators in a silicon-on-sapphire (SOS) platform. Since experimental characterization of microphotonic devices is especially challenging at the mid-IR, we also review our mid-IR characterization techniques in some detail. Additionally, pre- and post-processing techniques for improving device performance, such as resist reflow, Piranha clean/HF dip cycling, and annealing are discussed.


1994 ◽  
Vol 12 (5) ◽  
pp. 2808-2813 ◽  
Author(s):  
R. J. Tench ◽  
R. Chow ◽  
M. R. Kozlowski
Keyword(s):  

1993 ◽  
Vol 2 (5-7) ◽  
pp. 694-698 ◽  
Author(s):  
Hsien-Wen Ko ◽  
S.E. Hsu ◽  
S.J. Yang ◽  
M.S. Tsai ◽  
Y.H. Lee

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