New model for PCM melting and solidification processes simulation

2021 ◽  
Vol 96 (12) ◽  
pp. 125214
Author(s):  
Fatma Bouzgarrou ◽  
Talal Alqahtani ◽  
Salem Algarni ◽  
Sofiene Mellouli ◽  
Faouzi Askri ◽  
...  
2021 ◽  
Vol 297 ◽  
pp. 01008
Author(s):  
Ibtissam Lamaamar ◽  
Amine Tilioua ◽  
Zaineb Benzaid ◽  
Abdelouahed Ait Msaad ◽  
Moulay Ahmed Hamdi Alaoui

The high operating temperature of the photovoltaic (PV) modules decreases significantly its efficiency. The integration of phase change material (PCM) is one of the feasible techniques for reducing the operating temperature of the PV module. A numerical simulation of the PV module with PCM and without PCM has been realized. The thermal behavior of the PV module was evaluated at the melting and solidification processes of PCM. The results show that the integration of RT35HC PCM with a thickness of 4 cm reduces the temperature of the PV module by 8 °C compared to the reference module. Compared the RT35 and RT35HC, we found that the latent heat has a significant effect on the PCM thermal comportment. Furthermore, it has been found that the thermal resistance of the layers plays an important role to dissipate the heat from the PV cells to the PCM layer, consequently improving the heat transfer inside the PV/PCM system.


2004 ◽  
Vol 126 (5) ◽  
pp. 869-875 ◽  
Author(s):  
Ahmed Elgafy ◽  
Osama Mesalhy ◽  
Khalid Lafdi

In the present work, a computational model is developed to investigate and predict the thermal performance of high melting point phase change material during its melting and solidification processes within a cylindrical enclosure. In this model the phases are assumed to be homogeneous and a source term, S, arises from melting or solidification process is considered as a function of the latent heat of fusion and the liquid phase fraction. The numerical model is verified with a test problem and an experiment is performed to assess the validity of the assumptions of it and an agreement between experimental and computational results is achieved. The findings show that utilizing of PCMs of high melting points is a promising technique especially in space applications.


2009 ◽  
Vol 2009 ◽  
pp. 1-9 ◽  
Author(s):  
B. Korojy ◽  
L. Ekbom ◽  
H. Fredriksson

Microsegregation and solidification shrinkage were studied on copper-lead base alloys. A series of solidification experiments was performed, using differential thermal analysis (DTA) to evaluate the solidification process. The chemical compositions of the different phases were measured via energy dispersive X-ray spectroscopy (EDS) for the Cu-Sn-Pb and the Cu-Sn-Zn-Pb systems. The results were compared with the calculated data according to Scheil's equation. The volume change during solidification was measured for the Cu-Pb and the Cu-Sn-Pb systems using a dilatometer that was developed to investigate the melting and solidification processes. A shrinkage model was used to explain the volume change during solidification. The theoretical model agreed reasonably well with the experimental results. The deviation appears to depend on the formation of lattice defects during the solidification process and consequently on the condensation of those defects at the end of the solidification process. The formation of lattice defects was supported by quenching experiments, giving a larger fraction of solid than expected from the equilibrium calculation.


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