A novel method for simultaneous measurement of thickness, refractive index, bow, and warp of a large silicon wafer using a spectral-domain interferometer

Metrologia ◽  
2020 ◽  
Vol 57 (6) ◽  
pp. 064001
Author(s):  
Jungjae Park ◽  
Jaeseok Bae ◽  
Yoon-Soo Jang ◽  
Jonghan Jin
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