A novel method for simultaneous measurement of thickness, refractive index, bow, and warp of a large silicon wafer using a spectral-domain interferometer
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2017 ◽
Vol 35
(16)
◽
pp. 3584-3590
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2009 ◽
Vol 20
(1)
◽
pp. 29-33
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1986 ◽
Vol 22
(9)
◽
pp. 976-981
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