Anisotropic pressure dependence of the critical temperature inYBa2Cu3O7:A picture for pressure effects in cuprates

2000 ◽  
Vol 61 (5) ◽  
pp. 3672-3675 ◽  
Author(s):  
A. Perali ◽  
G. Varelogiannis
Keyword(s):  
Critical Temperature ◽  
Pressure Dependence ◽  
Pressure Effects ◽  
Anisotropic Pressure

Anisotropic pressure dependence of the critical temperature of REBa2Cu3O7−δ

1991 ◽  
Vol 185-189 ◽  
pp. 1947-1948 ◽  
Author(s):  
S.L. Bud'ko ◽  
O. Nakamura ◽  
J. Guimpel ◽  
M. Maple ◽  
Ivan K. Schuller
Keyword(s):  
Critical Temperature ◽  
Pressure Dependence ◽  
Anisotropic Pressure

Anisotropic pressure dependence of the resistivity inYBa2Cu4O8

1996 ◽  
Vol 53 (1) ◽  
pp. 94-96 ◽  
Author(s):  
B. Bucher ◽  
J. Karpinski ◽  
E. Kaldis ◽  
P. Wachter
Keyword(s):  
Pressure Dependence ◽  
Anisotropic Pressure

Highly Anisotropic Pressure Dependence of the Fermi Surface of CeSb

1997 ◽  
Vol 78 (10) ◽  
pp. 1948-1951 ◽  
Author(s):  
M. Takashita ◽  
H. Aoki ◽  
T. Matsumoto ◽  
C. J. Haworth ◽  
T. Terashima ◽  
...  
Keyword(s):  
Fermi Surface ◽  
Pressure Dependence ◽  
Anisotropic Pressure

scholarly journals Pressure dependence of the superconducting critical temperature ofTl2Ba2Ca2Cu3O10+yandTl2Ba2Ca3Cu4O12+yup to 21 GPa

1996 ◽  
Vol 54 (14) ◽  
pp. 10175-10185 ◽  
Author(s):  
D. Tristan Jover ◽  
R. J. Wijngaarden ◽  
R. Griessen ◽  
E. M. Haines ◽  
J. L. Tallon ◽  
...  
Keyword(s):  
Critical Temperature ◽  
Pressure Dependence

Anisotropic pressure effects on the charge order transition of (TMTTF)2X

2010 ◽  
Vol 405 (11) ◽  
pp. S113-S115 ◽  
Author(s):  
M. Nagasawa ◽  
T. Nagasawa ◽  
K. Ichimura ◽  
K. Nomura
Keyword(s):  
Charge Order ◽  
Order Transition ◽  
Pressure Effects ◽  
Anisotropic Pressure

Studies of Temperature and Pressure Dependence in Thermocompression Gold Joints

2005 ◽  
Author(s):  
X. F. Ang ◽  
G. G. Zhang ◽  
J. Wei ◽  
Z. Chen ◽  
C. C. Wong
Keyword(s):  
Shear Strength ◽  
Critical Temperature ◽  
Pressure Dependence ◽  
Bonding Temperature ◽  
Interfacial Stress ◽  
3D Integration ◽  
Bonding Pressure ◽  
Barrier Films ◽  
Linear Rise ◽  
Temperature And Pressure

Low temperature interconnection is a critical component of 3D integration and packaging technology. In this study, we investigate the characteristics of thermocompression metal bonding using gold stud bumps formed on Si die in the temperature range of 100-300 °C and the pressure range of 200–600 g/bump. We observed a critical bonding temperature below which bonding did not occur and above which shear strength improves linearly with bonding temperature. This critical temperature can be interpreted to be the onset of the break-up of organic barrier films while the linear rise in shear strength can be attributed to the increase in the true bonded area. Above this critical temperature, the tensile strength of the Au-Au bond exhibits a maximum with increasing bonding pressure. This can be related to the pressure dependence of the interfacial stress distribution and its effect on unbonded radius, r. SEM fractographs of the failed surfaces suggest a combination of cohesive and adhesive failures along the bonded interface.

Anisotropic pressure dependence ofTcin single-crystalYBa2Cu3O7via thermal expansion

1990 ◽  
Vol 41 (16) ◽  
pp. 11299-11304 ◽  
Author(s):  
C. Meingast ◽  
B. Blank ◽  
H. Bürkle ◽  
B. Obst ◽  
T. Wolf ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Pressure Dependence ◽  
Anisotropic Pressure
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