Wafer-Level 3D Integration Based on Poly (Diallyl Phthalate) Adhesive Bonding

Three-dimensional integration technology provides a promising total solution that can be used to achieve system-level integration with high function density and low cost. In this study, a wafer-level 3D integration technology using PDAP as an intermediate bonding polymer was applied effectively for integration with an SOI wafer and dummy a CMOS wafer. The influences of the procedure parameters on the adhesive bonding effects were determined by Si–Glass adhesive bonding tests. It was found that the bonding pressure, pre-curing conditions, spin coating conditions, and cleanliness have a significant influence on the bonding results. The optimal procedure parameters for PDAP adhesive bonding were obtained through analysis and comparison. The 3D integration tests were conducted according to these optimal parameters. In the tests, process optimization was focused on Si handle-layer etching, PDAP layer etching, and Au pillar electroplating. After that, the optimal process conditions for the 3D integration process were achieved. The 3D integration applications of the micro-bolometer array and the micro-bridge resistor array were presented. It was confirmed that 3D integration based on PDAP adhesive bonding is suitable for the fabrication of system-on-chip when using MEMS and IC integration and that it is especially useful for the fabrication of low-cost suspended-microstructure on-CMOS-chip systems.

Investigation on Processing Maps of Diffusion Bonding Process Parameters for Ti-6Al-4 V/AISI304 Dissimilar Joints

The diffusion bonding (DB) method is used in this investigation to connect high-temperature dissimilar materials. The existence of difficult-to-remove oxide coatings on the titanium surfaces, as well as the arrangement of breakable metallic interlayers and oxide enclosures inside the bond region, provides the most significant challenges during the transition from AISI304 to Ti-6Al-4V alloying. In addition, an effort was made to advance DB processing maps for the operational connection of Ti-6Al-4V to AISI304 alloys to improve their performance. Joints had been created by combining several process factors, such as bonding temperature (T), bonding pressure (P), and holding time (t), to create diverse designs. Based on the findings, database processing maps were created. This set of processing maps may be used as a rough guideline for selecting appropriate DB process parameters for generating virtuous excellent bonds between Ti-6Al-4V and AISI304 alloys. The maximum lap shear strength (LSS) was achieved at 800°C, 15 MPa, and 45 min.

Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints

Transient liquid phase sintering (TLPS) is a promising joining technology that can achieve high temperature resistant solder joints at low temperature, showing excellent potential in power electronics. In this work, Cu/Cu-In/Cu solder joints were successfully prepared by TLPS process. The effects of bonding pressure and holding time on the microstructure and shear strength of Cu-In TLPS joints at 260 and 320°C were studied. The results showed that as bonding pressure increased from 0.1–0.6 MPa, the porosity decreased and shear strength increased significantly. No obvious change was found as bonding pressure continued to increase to 1 MPa. As holding time increased at 260°C, Cu11In9 was formed and gradually transformed to Cu2In that can withstand elevated temperature. Meanwhile, the porosity decreased while shear strength increased. It was calculated that volume expansion (12.74%) occurred during the phase transition from Cu11In9 to Cu2In. When bonding temperature increased to 320°C, only Cu2In was detected and then gradually transformed to Cu7In3 with the growing holding time. As holding time reached 120 min, their porosity increased and lead to weak shear strength due to volume shrinkage (15.43%) during the phase transition from Cu2In to Cu7In3.

Bonding SiCp/Al Composites via Laser-Induced Exothermic Reactions

In this paper, the SiCp/Al composites were bonded via laser-induced exothermic reactions of a Ni–Al–Zr interlayer. The Ni–Al–Zr interlayer was designed based on its exothermic property and chemical compatibility with the SiCp/Al composites. The influences of the interlayer composition and bonding pressure on the joint microstructure and shear strength were investigated. Results indicated that high exothermic reactions occurred in the Ni–Al–Zr interlayer and realized the reliable bonding with the SiCp/Al composites. The interlayer products were the eutectic structure of NiAl+Ni2AlZr+Ni3Al5Zr2. NiAl3 and Ni2Al3 reaction layers were formed at the bonding interfaces. The interlayer composition and the bonding pressure determined the morphology and distribution of the voids and the reaction layers, thus controlling the joint shear strength. When the SiCp/Al composites were bonded using the interlayer with the Zr content of 15 wt.% under the bonding pressure of 3 MPa, the joint shear strength reached the maximum of 24 MPa.

Mechanical and microstructure property evaluation of diffusion bonding of 5083, 6061 and 7075 aluminium to AZ31 magnesium using Cu interlayer

The diffusion bonding of 7075, 6061 and 5083 aluminium alloys to AZ31B magnesium was investigated using copper interlayer. An optical microscope along with scanning electron microscopes, equipped with an energy dispersive spectrometry/electron probe microanalysis, was utilized to characterize the microstructure of the joint. The mechanical properties of the joint were also assessed by micro-hardness and shear strength tests. The results indicate the high effect of temperature on the bonding results; so that, with a small change in temperature, severe changes were observed in the bonding results. A temperature range of 475°C–485°C and a minimum duration of 30 min with a low bonding pressure of 0.4 MPa were identified as advisable process conditions. The joint evaluation revealed the formation of CuAl2, Cu9Al4 and Al-Mg-Cu ternary phases on the aluminium-copper side, as well as Cu2Mg, CuMg2 and Al-Mg-Cu ternary phases on the magnesium-copper side in the reaction layer. When increasing the bonding temperature and duration, the amount of intermetallic compounds and, as a result, the mechanical properties of the joints changed. The highest shear strength and micro-hardness, related to the bonding performed at 480°C and holding time of 45 min, were 31.03 MPa and 167 HV, respectively.

Gluing Techniques on Bond Performance and Mechanical Properties of Cross-Laminated Timber (CLT) Made from Larix kaempferi

Previous studies have proved that Larix kaempferi is a good material for preparing cross-laminated timber (CLT), but under bending shear stress, CLT made by Larix kaempferi is prone to the phenomenon of bonding face cracking, which seriously affects the shear performance of CLT. To solve this problem, this paper took Larix kaempferi as raw material, conducted experiments on the surface sanding conditions, gluing pressure and adhesive types of sawing timber, and explored the influence of these three factors on the bonding quality of CLT. The microscopic characteristics of the bonding layer were further studied. The results showed that for Larix kaempferi with a density of 0.68 g/cm3 used in this experiment, a high bonding pressure is required. Among the three cold curing adhesives selected in the experiment, emulsion polymer isocyanate (EPI) adhesive needs 1.5 MPa bonding pressure to ensure the bonding quality, while for polyurethane (PUR) and phenol resorcinol formaldehyde (PRF), 1.2 MPa can meet the need of adhesive pressure. This is concerned with the permeability of different adhesives under different pressures. The microscopic results of the bonding layer show that EPI adhesives have poor permeability, so it requires high bonding pressure. The influence of sanding surface of different sand-belt on block shear strength (BSS) and wood failure percentage (WFP) is not obvious, while the durability of bonding layer is better when sanding mesh number is 100. Hence, a high pressure should be used for CLT industrial production when the laminate density is higher, especially when the adhesive has poor permeability. Reasonable sanding surface treatment can be used in laminate surface treatment to improve the durability of CLT.

Prediction of Tensile Strength and Deformation of Diffusion Bonding Joint for Inconel 718 Using Deep Neural Network

Due to the acceptable high-temperature deformation resistance of Inconel 718, its welding parameters such as bonding temperature and pressure are inevitably higher than those of general metals. As a result of the existing punitive processing environment, it is essential to control the deformation of parts while ensuring the bonding performance. In this research, diffusion bonding experiments based on the Taguchi method (TM) are conducted, and the uniaxial tensile strength and deformation ratio of the experimental joints are measured. According to experimental data, a deep neural network (DNN) was trained to characterize the nonlinear relationship between the diffusion bonding process parameters and the diffusion bonding strength and deformation ratio, where the overall correlation coefficient came out to be 0.99913. The double-factors analysis of bonding temperature–bonding pressure based on the prediction results of the DNN shows that the temperature increment of the diffusion bonding of Inconel 718 significantly increases the deformation ratio of the diffusion bonding joints. Therefore, during the multi-objective optimization of the bonding performance and deformation of components, priority should be given to optimizing the bonding pressure and duration only.