scholarly journals Phosphorus Donors in Highly Strained Silicon

2006 ◽  
Vol 97 (16) ◽  
Author(s):  
Hans Huebl ◽  
Andre R. Stegner ◽  
Martin Stutzmann ◽  
Martin S. Brandt ◽  
Guenther Vogg ◽  
...  
2021 ◽  
Vol 130 (5) ◽  
pp. 055105
Author(s):  
Nicolas Roisin ◽  
Guillaume Brunin ◽  
Gian-Marco Rignanese ◽  
Denis Flandre ◽  
Jean-Pierre Raskin

2020 ◽  
Vol MA2020-02 (22) ◽  
pp. 1618-1618
Author(s):  
Laurent Gaëtan Michaud ◽  
Clément Castan ◽  
Pierre Montméat ◽  
Edy Azrak ◽  
Nikita Nikitskiy ◽  
...  

2019 ◽  
Vol 3 (6) ◽  
pp. 107-117 ◽  
Author(s):  
Takeshi Akatsu ◽  
Jean-Michel Hartmann ◽  
Cécile Aulnette ◽  
Yves-Matthieu Le Vaillant ◽  
Denis Rouchon ◽  
...  

2008 ◽  
Vol 29 (5) ◽  
pp. 468-470 ◽  
Author(s):  
Osama M. Nayfeh ◽  
CÁit NÍ ChlÉirighChleirigh ◽  
Judy L. Hoyt ◽  
Dimitri A. Antoniadis

2020 ◽  
Vol 128 (4) ◽  
pp. 045704
Author(s):  
L. B. Spejo ◽  
J. L. Arrieta-Concha ◽  
M. V. Puydinger dos Santos ◽  
A. D. Barros ◽  
K. K. Bourdelle ◽  
...  

2014 ◽  
Vol 936 ◽  
pp. 255-258 ◽  
Author(s):  
Bin Shu ◽  
Jing Ming Chen ◽  
He Ming Zhang ◽  
Feng Zhu ◽  
Pu Li Quan ◽  
...  

The mechanism of high stress in silicon nitride thin film is studied systematically in this paper. The effects of the various process parameters on the stress in silicon nitride thin film deposited by PECVD are analyzed and discussed. The silicon nitride thin film with high compressive and tensile stress has been deposited on the optimized process parameters and the compressive and tensile stress are up to-1.38GPa and 866MPa, respectively. Finally, the method of further improving the stress in silicon nitride thin film is presented.


2021 ◽  
Vol 130 (20) ◽  
pp. 209901
Author(s):  
Nicolas Roisin ◽  
Guillaume Brunin ◽  
Gian-Marco Rignanese ◽  
Denis Flandre ◽  
Jean-Pierre Raskin

2003 ◽  
Vol 765 ◽  
Author(s):  
Minjoo L. Lee ◽  
Eugene A. Fitzgerald

AbstractThe use of alternative channel materials such as germanium [1,2] and strained silicon (ε-Si) [3-5] is increasingly being considered as a method for improving the performance of MOSFETs. While ε-Si grown on relaxed Si1-x Gex is drawing closer to widespread commercialization, it is currently believed that almost all of the performance benefit in CMOS implementations will derive from the enhanced mobility of the n -MOSFET [5]. In this paper, we demonstrate that ε-Si p -MOSFETs can be engineered to exhibit mobility enhancements that increase or remain constant as a function of inversion density. We have also designed and fabricated ε-Si / ε-Ge dual-channel p -MOSFETs exhibiting mobility enhancements of 10 times. These p -MOSFETs can be integrated on the same wafers as ε-Si n -MOSFETs, making symmetric-mobility CMOS possible.


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