scholarly journals Small-angle neutron scattering from CuCrZr coupons and components

2021 ◽  
Vol 54 (5) ◽  
Author(s):  
F. Schoofs ◽  
S. King ◽  
A. J. Cackett ◽  
M. Leyland ◽  
C. Hardie

Small-angle neutron scattering (SANS) is performed to analyse the microstructural state of a reference CuCrZr material with carefully controlled heat treatments, small-scale manufacturing mock-ups of assemblies and high-heat-flux-exposed mock-ups for fusion reactor components. The information derived from the SANS data corresponds well to existing literature data based on microscopic-scale techniques, but is obtained at millimetre scale with minimal surface preparation. The manufacturing method and high-heat-flux testing conditions are confirmed to have little impact on the microstructural properties, demonstrating the validity of these treatments for scaled-up reactor components.

2007 ◽  
Vol 16 (1) ◽  
pp. 96-103 ◽  
Author(s):  
Kendall J. Hollis ◽  
Brian D. Bartram ◽  
Manfred Roedig ◽  
Dennis Youchison ◽  
Richard Nygren

2010 ◽  
Vol 63 ◽  
pp. 383-391
Author(s):  
Chang Chun Ge ◽  
Shuang Quan Guo ◽  
Yun Biao Feng ◽  
Zhang Jian Zhou ◽  
Juan Du ◽  
...  

Different coating technologies, such as plasma spray (PS), physical vapor deposition (PVD) and chemical vapor deposition (CVD), which can fabricate the PFM and join it to heat sink materials simultaneously, were applied for the fabrication of plasma facing materials (PFM) in fusion reactor. In the Institute of Nuclear Materials, University of Science and Technology Beijing (USTB), the concept of functionally graded materials (FGM) was adopted to fabricate coatings for effectively alleviating the thermal stress generated between coatings and the substrate materials under high heat flux loading (5~20 MW/m2). In the last several years, functionally graded coatings, including B4C/Cu, W/Cu and Mo/Cu systems were successfully fabricated by atmospheric plasma spray (APS). Characterization of coatings was performed in order to assess microstructure, mechanical properties and high heat flux properties of the FGM coatings. Furthermore, a high thick tungsten coating with 4 mm on copper – chromium - zirconium (Cu, Cr, Zr) alloy substrates was fabricated by APS. The porosity of the coating is less than 2% while mean tensile strength of the coating is about 7 MPa. However, the content of oxygen in the coating is about 6 wt% by energy dispersive spectrum (EDS) analysis, thus further optimization is necessary.


1998 ◽  
Vol 39-40 ◽  
pp. 211-218 ◽  
Author(s):  
G Vieider ◽  
V Barabash ◽  
A Cardella ◽  
P Chappuis ◽  
R Duwe ◽  
...  

2018 ◽  
Vol 551 ◽  
pp. 407-412 ◽  
Author(s):  
R. Coppola ◽  
M. Klimenkov ◽  
R. Lindau ◽  
A. Möslang ◽  
M. Rieth ◽  
...  

Author(s):  
S. Ravi Annapragada ◽  
Matthew R. Pearson ◽  
William A. Rioux ◽  
Charles E. Lents

Improvements in electronic devices have led to increased power densities and need for small scale miniature cooling solutions. To address this issue, Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office (MTO) created the Active Cooling Modules (ACM) effort to develop technology solutions able to provide small scale (4 cm2) active high heat flux cooling of a 100W device (25 W/cm2) at a 15 °C temperature lift with Coefficient Of Performance (COP) comparable to state of the art thermoelectric coolers. Thin-film thermoelectric cooling devices are well suited to provide high heat flux active cooling. In the present work, an experimental apparatus is developed to characterize the performance of a subscale thin-film thermoelectric cooling modules 1/144th, 1/36th and 1/9th the size of a full scale 4 cm2 device. An in-situ calibration methodology is proposed to characterize the performance of these thermoelectric microcoolers. In this early development work, vacuum conditions are maintained to minimize thermal losses between the thermoelectric module sink and source sides. The small size of the subscale devices and vacuum conditions introduce additional uncertainties into the system and could lead to errors in COP measurement (>0.5). The additional sources of errors as the device dimensions shrink are identified and minimized leading to energy balance in the system.


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