Recycling of Printed Wiring Boards with Mounted Electronic Components

Circuit World ◽  
1997 ◽  
Vol 23 (3) ◽  
pp. 10-15 ◽  
Author(s):  
M. Iji ◽  
S. Yokoyama
Keyword(s):  
Printed Wiring Boards ◽  
Electronic Components

Laser Processing of Parmod™ Functional Electronic Materials

2000 ◽  
Vol 624 ◽  
Author(s):  
Paul H. Kydd ◽  
David L. Richard ◽  
Douglas B. Chrisey ◽  
Kenneth H. Church
Keyword(s):  
Laser Processing ◽  
Electronic Materials ◽  
Health And Safety ◽  
Thermal Curing ◽  
Printed Wiring Boards ◽  
Electronic Components ◽  
Additive Process ◽  
Safety Issues ◽  
Flexible Polymer ◽  
Conventional Plate

ABSTRACTParmod™ is a family of materials that can be printed and thermally cured to create metallic conductors on printed wiring boards. This additive process provides a way to produce circuitry direct from CAD files without the necessity for intermediate tooling of any kind. The printed images are converted to pure metallic traces in seconds at a temperature low enough to be compatible with commonly used rigid and flexible polymer-based substrates. This simple, two-step process eliminates the hazardous wastes and employee health and safety issues associated with conventional plate-and-etch photolithographic technologyRecently the Parmod™ technology has been extended from metals to oxides to enable printing passive electronic components such as resistors, capacitors and inductors, as well as the metallic interconnects. While thermal curing of the oxides provides useable electronic properties, particularly of resistors and capacitors, the performance of all these novel materials could be improved by laser processing. This paper discusses preliminary results on laser processing of Parmod™ conductors and components in two different systems

Multiobjective Optimal Placement of Convectively and Conductively Cooled Electronic Components on Printed Wiring Boards

1999 ◽  
Vol 122 (2) ◽  
pp. 152-159 ◽  
Author(s):  
Nestor V. Queipo ◽  
Guy F. Gil
Keyword(s):  
Heat Transfer ◽  
Genetic Algorithm ◽  
Optimal Placement ◽  
Printed Wiring Boards ◽  
Multiattribute Utility ◽  
Utility Analysis ◽  
Electronic Components ◽  
Multiattribute Utility Analysis ◽  
Solution Methodology

This paper presents a solution methodology for the optimal placement of convectively and conductively air-cooled electronic components on planar printed wiring boards considering thermal and electrical/cost design objectives. The methodology combines the use of a heat transfer solver for the prediction of the temperature distribution among the electronic components and a genetic algorithm for the adaptive search of optimal or near optimal solutions and a multiobjective optimization strategy (Pareto optimization and multiattribute utility analysis). After proper validation of the elements of the solution methodology (heat transfer solver/genetic algorithm) in isolation, the methodology under consideration is tested using a placement problem (case study) that considers as optimization criteria the minimization of an estimate of the failure rate of the system of components due to thermal overheating (via an Arrhenius relation) and the minimization of the total wiring length given some interconnectivity requirements. Results corresponding to the case study are presented and discussed for both Pareto optimization and multiattribute utility analysis. [S1043-7398(00)00801-X]

Electrostatic Printing, a Versatile Manufacturing Process for the Electronics Industries

2000 ◽  
Vol 625 ◽  
Author(s):  
Robert H. Detig
Keyword(s):  
Functional Materials ◽  
Polymeric Films ◽  
Flat Panel Displays ◽  
Printed Wiring Boards ◽  
Electronic Components ◽  
Printing Plate ◽  
Coated Metal ◽  
High K ◽  
Manufacturing Applications ◽  
High K Dielectric

AbstractFunctional materials configured as liquid toners are printed on a variety of substrates for various manufacturing processes. The materials include metal toners, resistor toners, high k dielectric toners, phosphors and glass. The substrates printed upon include glass, bare and coated metal, polymeric films and even paper. A fixed configuration electrostatic printing plate is used in most manufacturing applications though traditional photo receptor plates can be used if electronic addressability is desired.Applications of electrostatic printing for electronic packaging products (printed wiring boards and flex circuits) and of passive electronic components themselves will be shown. Results with a pure silver toner printed on both glass and paper will be reported. Examples of passive electronic components like resistors, capacitors, and even inductors that have been electrostatically printed with liquid toners will be shown. Possible applications of toners to the manufacture of flat panel displays will be discussed.

Electrostatic Printing, A Versatile Manufacturing Process for the Electronics Industries

2000 ◽  
Vol 624 ◽  
Author(s):  
Robert H. Detig
Keyword(s):  
Functional Materials ◽  
Polymeric Films ◽  
Flat Panel Displays ◽  
Printed Wiring Boards ◽  
Electronic Components ◽  
Printing Plate ◽  
Coated Metal ◽  
High K ◽  
Manufacturing Applications ◽  
High K Dielectric

ABSTRACTFunctional materials configured as liquid toners are printed on a variety of substrates for various manufacturing processes. The materials include metal toners, resistor toners, high k dielectric toners, phosphors and glass. The substrates printed upon include glass, bare and coated metal, polymeric films and even paper. A fixed configuration electrostatic printing plate is used in most manufacturing applications though traditional photo receptor plates can be used if electronic addressability is desired.Applications of electrostatic printing for electronic packaging products (printed wiring boards and flex circuits) and of passive electronic components themselves will be shown. Results with a pure silver toner printed on both glass and paper will be reported. Examples of passive electronic components like resistors, capacitors, and even inductors that have been electrostatically printed with liquid toners will be shown. Possible applications of toners to the manufacture of flat panel displays will be discussed.

Tailoring Temperature/Humidity Life Tests with In-Service Environment Data

1998 ◽  
Vol 41 (4) ◽  
pp. 36-42 ◽  
Author(s):  
Kevin Cluff ◽  
Donald Barker
Keyword(s):  
Moisture Resistance ◽  
Printed Wiring Boards ◽  
Electronic Components ◽  
Service Environment ◽  
Life Tests

Humidity combined with temperature and voltage is considered a major failure stimulus in electronic components, printed wiring boards, and assemblies. Accelerated temperature/humidity tests are commonly used to evaluate the moisture resistance of electronics, but these are rarely linked to the application environment. This work proposes a methodology to determine realistic tests based on measured usage environments. Plastic encapsulated microcircuits in the commercial airplane environment will be used to demonstrate the approach.

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