Molecular dynamics simulation of micro‐Poiseuille flow for liquid argon in nanoscale

2004 ◽  
Vol 14 (5) ◽  
pp. 664-688 ◽  
Author(s):  
J.L. Xu ◽  
Z.Q. Zhou ◽  
X.D. Xu
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Poiseuille Flow ◽  
Liquid Argon ◽  
Dynamics Simulation

Thermal Conductivity Computation of Nanofluids by Equilibrium Molecular Dynamics Simulation: Nanoparticle Loading and Temperature Effect

2007 ◽  
Vol 1022 ◽  
Author(s):  
Suranjan Sarkar ◽  
R. Panneer Selvam
Keyword(s):  
Thermal Conductivity ◽  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Effective Thermal Conductivity ◽  
Copper Nanoparticles ◽  
Base Fluid ◽  
Liquid Argon ◽  
Dynamics Simulation ◽  
System Temperature ◽  
Solid Copper

AbstractA model nanofluid system of copper nanoparticles in argon base fluid was successfully modeled by molecular dynamics simulation. The interatomic interactions between solid copper nanoparticles, base liquid argon atoms and between solid copper and liquid argon were modeled by Lennard Jones potential with appropriate parameters. The effective thermal conductivity of the nanofluids was calculated through Green Kubo method in equilibrium molecular dynamics simulation for varying nanoparticle concentrations and for varying system temperatures. Thermal conductivity of the basefluid was also calculated for comparison. This study showed that effective thermal conductivity of nanofluids is much higher than that of the base fluid and found to increase with increased nanoparticle concentration and system temperature. Through molecular dynamics calculation of mean square displacements for basefluid, nanofluid and its components, we suggested that the increased movement of liquid atoms in the presence of nanoparticle was probable mechanism for higher thermal conductivity of nanofluids.

An Investigation on Thermal Conductivity of Fluid in a Nanochannel by Nonequilibrium Molecular Dynamics Simulations

2020 ◽  
Vol 142 (3) ◽  
Author(s):  
Mohammad Bagheri Motlagh ◽  
Mohammad Kalteh
Keyword(s):  
Thermal Conductivity ◽  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Poiseuille Flow ◽  
Driving Force ◽  
Dynamics Simulation ◽  
Nonequilibrium Molecular Dynamics ◽  
Wall Roughness ◽  
Dynamics Simulations ◽  
Effect Of Copper

Abstract In this paper, molecular dynamics simulation is used to investigate the effect of copper and argon nanochannels size on the thermal conductivity of argon. Thermal conductivity is calculated by nonequilibrium molecular dynamics (NEMD) simulation. Simulations are performed for different distances between the walls. Results for both copper and argon walls are investigated individually. Results show that the existence of argon walls has little effect on the thermal conductivity. However, the amount of it for the argon confined between the copper walls is affected by the distance between the two walls. In the same way, the effect of wall roughness on the thermal conductivity is investigated, which shows that roughness is effective only for low distances between the walls. Also, the thermal conductivity of argon under Poiseuille flow in a nanochannel is studied. The results indicate that by increasing the driving force, the thermal conductivity increases and the increase ratio is higher for larger forces.

Molecular Dynamics Simulation of Pool Boiling Heat Transfer of Nanofluids on Rough Walls

2017 ◽  
Author(s):  
Xunyan Yin ◽  
Minli Bai ◽  
Chengzhi Hu ◽  
Jizu Lv
Keyword(s):  
Heat Transfer ◽  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Boiling Heat Transfer ◽  
Heating Temperature ◽  
Pool Boiling ◽  
Liquid Argon ◽  
Dynamics Simulation ◽  
Pool Boiling Heat Transfer ◽  
Rough Walls

Molecular dynamics simulation was performed to investigate pool boiling heat transfer of nanofluids on rough walls. Nanoparticle movement was calculated to investigate the physical mechanisms of boiling heat transfer. The simulated system consisted of four regions: vapor argon, liquid argon, solid copper, and copper nanoparticles, and three cases were considered: base fluids (case A), nanoparticles far from the wall (case B), and nanoparticles near the wall (case C). Boiling heat transfer was enhanced by the addition of nanoparticles, and the enhancement increased with increasing heating temperature. Case C showed that nanoparticles were adsorbed on the nonevaporated film and did not move with the fluids. Thus, nanoparticles enhanced heat and energy transfer between the wall and fluids. Case B showed that nanoparticles moved randomly in the fluid area, which enhanced heat transfer within the fluid.

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