Transient and crosstalk analysis of slightly lossy interconnection lines for wafer scale integration and wafer scale hybrid packaging-weak coupling case
1988 ◽
Vol 35
(11)
◽
pp. 1369-1382
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Keyword(s):
1988 ◽
Vol 135
(6)
◽
pp. 281
1995 ◽
Vol 06
(04)
◽
pp. 631-645
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2019 ◽
Vol 27
(2)
◽
pp. 304-315
1985 ◽
Vol 1
(4)
◽
pp. 24-34
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