Effect of material interactions during thermal shock testing on IC package reliability

1993 ◽  
Vol 16 (8) ◽  
pp. 932-939 ◽  
Author(s):  
A.S. Chen ◽  
L.T. Nguyen ◽  
S.A. Gee
Keyword(s):  
Thermal Shock ◽  
Shock Testing ◽  
Ic Package ◽  
Package Reliability

Structure Evolution of 7YSZ Thermal Barrier Coating During Thermal Shock Testing

2015 ◽  
Vol 30 (12) ◽  
pp. 1261
Author(s):  
ZHANG Xiao-Feng ◽  
ZHOU Ke-Song ◽  
ZHANG Ji-Fu ◽  
ZHANG Yong ◽  
LIU Min ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Thermal Barrier Coating ◽  
Structure Evolution ◽  
Thermal Barrier ◽  
Shock Testing ◽  
Barrier Coating

281. An evaluation of the critical pv-values of carbons for a mechanical seal by thermal shock testing

Carbon ◽  
1982 ◽  
Vol 20 (2) ◽  
pp. 156
Author(s):  
S. Sato ◽  
K. Kawamata ◽  
J. Aizawa ◽  
M. Ishii
Keyword(s):  
Thermal Shock ◽  
Mechanical Seal ◽  
Shock Testing

Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Lead Frame ◽  
Shear Forces ◽  
Microstructural Investigation ◽  
Shock Testing ◽  
Ceramic Capacitor ◽  
Board Level ◽  
Board Level Reliability ◽  
Thermal Shocks

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

151. Thermal shock testing using focused electron beam heating

Carbon ◽  
1969 ◽  
Vol 7 (6) ◽  
pp. 732
Author(s):  
R.D Reiswig ◽  
P.E Armstrong ◽  
L.S Levinson
Keyword(s):  
Electron Beam ◽  
Thermal Shock ◽  
Shock Testing ◽  
Beam Heating ◽  
Electron Beam Heating

Observations on the characteristics of a fluidized bed for the thermal shock testing of brittle ceramics

1982 ◽  
Vol 17 (9) ◽  
pp. 2553-2559 ◽  
Author(s):  
K. Niihara ◽  
J. P. Singh ◽  
D. P. H. Hasselman
Keyword(s):  
Thermal Shock ◽  
Fluidized Bed ◽  
Shock Testing

Thermal shock testing of sprayed ceramic coatings

1989 ◽  
Vol 67 (1) ◽  
pp. 95-98 ◽  
Author(s):  
D. R. Bury ◽  
D. R. Eastham
Keyword(s):  
Thermal Shock ◽  
Ceramic Coatings ◽  
Shock Testing

Failure Mechanisms During Thermal Shock Testing of Advanced Ceramics by Means of Lamp Irradiation

2006 ◽  
pp. 343-352
Author(s):  
V. Knoblauch ◽  
G. A. Schneider ◽  
W. Dreßler ◽  
H. Böder ◽  
G. Schneider ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Failure Mechanisms ◽  
Advanced Ceramics ◽  
Shock Testing
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