Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers

Offshore wind farm is developed in the ascendant currently. The reliable operation, power loss, investment cost and performance of wind farms were effect by the integration solutions of electrical interconnection system directly. Several new integration configurations based on VSC-HVDC were comparative analyzed. For the new HVDC topology applied the wind farm internal DC bus, the Variable Speed DC (VSDC) system that is suitable for those topologies was proposed. The structure of VSDC was discussed and maximum wind power tracking was simulated on the minimal system. It is clear that new integration configurations based on VSC-HVDC has good prospects.

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Reconfigurable electrical interconnection strategies for photovoltaic arrays: A review

Renewable and Sustainable Energy Reviews ◽

10.1016/j.rser.2014.01.070 ◽

2014 ◽

Vol 33 ◽

pp. 412-426 ◽

Cited By ~ 99

Author(s):

Damiano La Manna ◽

Vincenzo Li Vigni ◽

Eleonora Riva Sanseverino ◽

Vincenzo Di Dio ◽

Pietro Romano

Keyword(s):

Photovoltaic Arrays ◽

Electrical Interconnection

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Sub-Micron Electrical Interconnection Enabled Ultra-High I/O Density Wafer Level SiP Integration

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2017.22 ◽

2017 ◽

Cited By ~ 1

Author(s):

C. J. Wu ◽

S. T. Hsiao ◽

W. H. Lin ◽

H. Y. Chen ◽

T. L. Shao ◽

...

Keyword(s):

Wafer Level ◽

Electrical Interconnection

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Solid-State Formation of Intermetallic Compounds in Co-Sb Couple Nanowires

International Symposium on Microelectronics ◽

10.4071/isom-2010-ta3-paper5 ◽

2010 ◽

Vol 2010 (1) ◽

pp. 000093-000097

Author(s):

Seong Gi Jeon ◽

Jae Yong Song ◽

Ho Sun Shin ◽

Jin Yu

Keyword(s):

Heat Treatment ◽

Intermetallic Compounds ◽

Anodic Aluminum Oxide ◽

Fast Diffusion ◽

One Dimensional ◽

Anodic Aluminum ◽

Electrical Interconnection ◽

Electrochemically Deposited ◽

Kirkendall Voids ◽

Anodic Aluminum Oxide Templates

Nanointerconnection technologies have attracted much attention for the future electrical interconnection in electronic packaging. Nanowire interconnection needs to form the intermetallic compounds (IMCs) between the nanowires, in order to effectively reduce the contact resistances. In this study, the couple nanowires of Co and Sb elements were selected to investigate the IMC formation in one dimensional confinement. The Co and Sb nanowires were electrochemically deposited into the anodic aluminum oxide templates, in sequence, which had the pore diameters of about 30 and 60 nm, respectively. Results show that the CoSb phase is formed between Co nanowire and Sb nanowire after heat-treatment at 773 K. The IMC formation was ascribed to the dominant diffusion of Sb atoms toward the Co nanowire. The fast diffusion of Sb atoms toward the Co nanowire resulted in the formation of Kirkendall voids between the IMC and Sb nanowires.

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Mechanism of contact enhancing chemicals for electrical interconnection

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/6144.868854 ◽

2000 ◽

Vol 23 (3) ◽

pp. 535-541 ◽

Cited By ~ 2

Author(s):

G. Gao ◽

D. Shangguan

Keyword(s):

Electrical Interconnection

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FABRICATION OF N-ELECTRODES NANOJUNCTIONS FOR MONOMOLECULAR ELECTRONIC INTERCONNECTS

International Journal of Nanoscience ◽

10.1142/s0219581x04002036 ◽

2004 ◽

Vol 03 (03) ◽

pp. 233-245 ◽

Cited By ~ 4

Author(s):

O. CACCIOLATI ◽

C. JOACHIM ◽

J. P. MARTINEZ ◽

F. CARCENAC

Keyword(s):

Molecular Electronics ◽

Metallic Nanowires ◽

Input Output ◽

Atomic Wires ◽

Electrical Interconnection ◽

New Process ◽

N Input ◽

20 Nm

A new e-beam nanolithography process is presented to fabricate N-electrodes nanojunctions for the electrical interconnection of a monomolecular circuit having N input/output. The fabricated electrodes of the junction have a width below 20 nm and are buried at the SiO 2 surface. N=20 of such electrodes can be positioned on a circle of a diameter below 200 nm. An interconnection roadmap for molecular electronics is discussed to put this new process in perspective with the different possible ways of interconnecting a monomolecular circuit via atomic wires, nanotubes or metallic nanowires.

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