2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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342
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12
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9781509063154
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Efficient, Easy-to-Use, Planar Fiber-to-Chip Coupling Process with Angle-Polished Fibers

2017 ◽  
Author(s):  
Djorn Karnick ◽  
Nils Bauditsch ◽  
Lars Eisenblatter ◽  
Thomas Kuhner ◽  
Marc Schneider ◽  
...  
Keyword(s):  
Coupling Process

Interfacial Delamanination of Mold Compound in Fan-Out Packages

2017 ◽  
Author(s):  
V. N. N. Trilochan Rambhatla ◽  
David Samet ◽  
P. Markondeya Raj ◽  
Satomi Kawamoto ◽  
Rao R. Tummala ◽  
...  

Solder Mobility for High-Yield Self-Aligned Flip-Chip Assembly

2017 ◽  
Author(s):  
Yves Martin ◽  
Swetha Kamlapurkar ◽  
Jae-Woong Nah ◽  
Nathan Marchack ◽  
Tymon Barwicz
Keyword(s):  
Flip Chip ◽  
High Yield ◽  
Flip Chip Assembly

Electrical and Thermal Simulation of SWIFT (TM) High-Density Fan-Out PoP Technology

2017 ◽  
Author(s):  
Curtis Zwenger ◽  
George Scott ◽  
Bora Baloglu ◽  
Mike Kelly ◽  
WonChul Do ◽  
...  
Keyword(s):  
Thermal Simulation ◽  
High Density

The Reduction of Outgas from Pre-Applied Underfill Materials by Optimizing the Combination of Base Resin and Flux Compound

2017 ◽  
Author(s):  
Kohei Higashiguchi ◽  
Takenori Takiguchi ◽  
Masashi Okaniwa ◽  
Katsutoshi Ihara ◽  
Tsuyoshi Kida ◽  
...  
Keyword(s):  
Base Resin

Equalization Enhancement Approaches for PAM4 Signaling for Next Generation Speeds

2017 ◽  
Author(s):  
J. He ◽  
N. Dikhaminjia ◽  
M. Tsiklauri ◽  
J. Drewniak ◽  
A. Chada ◽  
...  
Keyword(s):  
Next Generation

Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application

2017 ◽  
Author(s):  
Kohei Tatsumi ◽  
Masakazu Inagaki ◽  
Kazuhito Kamei ◽  
Tomonori Iizuka ◽  
Hiroaki Narimatsu ◽  
...  
Keyword(s):  
High Temperature ◽  
Packaging Technology
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