With the increasing speed of information and communication equipments in recent years, together with the high-speed signal processing of LSIs, there is a requirement for build-up electrical insulation materials (used in IC package substrates) to have low-dielectric loss tangent which reduces dielectric loss so as to achieve low transmission loss in the high-frequency GHz bands. At the same time, there is an increasing need for materials to have low-CTEs (Coefficient of Thermal Expansion) so as to ensure highly reliable substrates.
With ou formulation technology, we have developed a next-generation film-shaped build-up electrical insulation material compatible with high-frequency signal transmission by using a composition of practical thermosetting epoxy resin, which has realized both a low-dielectric loss tangent and at the same time, a low-CTE.
In addition, this material can show a low-surface roughness after the film desmear process. It is thus expected to help reduce not only dielectric loss by means of a low-dielectric loss tangent, but also conductor loss caused by the skin effect, and will promote fine line formation by means of SAP (Semi Additive Process).
Unsaturated polyester resin as an electrical insulation material
