2011 IEEE 13th Electronics Packaging Technology Conference
Latest Publications

TOTAL DOCUMENTS

165

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781457719820, 9781457719837, 9781457719813

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal performance evaluation of a synthetic jet heat sink for electronic cooling

2011 IEEE 13th Electronics Packaging Technology Conference ◽

10.1109/eptc.2011.6184390 ◽

2011 ◽

Cited By ~ 2

Author(s):

T T Chandratilleke ◽

R Narayanaswamy ◽

D Jagannatha

Keyword(s):

Performance Evaluation ◽

Thermal Performance ◽

Heat Sink ◽

Synthetic Jet ◽

Electronic Cooling

Download Full-text

A simplified approach to simulate bubble nucleation in flow boiling

2011 IEEE 13th Electronics Packaging Technology Conference ◽

10.1109/eptc.2011.6184477 ◽

2011 ◽

Cited By ~ 1

Author(s):

X. Q. Xing ◽

Y. J. Lee ◽

Y. Y. Hoe ◽

X. Zhang ◽

S. Gao ◽

...

Keyword(s):

Flow Boiling ◽

Bubble Nucleation ◽

Simplified Approach

Download Full-text

Reliability of copper wire bonding in humidity environment

2011 IEEE 13th Electronics Packaging Technology Conference ◽

10.1109/eptc.2011.6184385 ◽

2011 ◽

Cited By ~ 5

Author(s):

Hai Liu ◽

Zhenqing Zhao ◽

Qiang Chen ◽

Jianwei Zhou ◽

Maohua Du ◽

...

Keyword(s):

Copper Wire ◽

Wire Bonding ◽

Copper Wire Bonding ◽

Humidity Environment

Download Full-text

Effect of microstructure on thermal-mechanical stress in 3D copper TSV structures

2011 IEEE 13th Electronics Packaging Technology Conference ◽

10.1109/eptc.2011.6184463 ◽

2011 ◽

Cited By ~ 2

Author(s):

Zhiyong Wu ◽

Zhiheng Huang ◽

Paul P. Conway ◽

Yucheng Ma

Keyword(s):

Mechanical Stress ◽

Effect Of Microstructure

Download Full-text

Build-up electrical insulation material with low-dielectric loss tangent, low-CTE and low-surface roughness

2011 IEEE 13th Electronics Packaging Technology Conference ◽

10.1109/eptc.2011.6184447 ◽

2011 ◽

Cited By ~ 2

Author(s):

Eita Horiki ◽

Isao Suzuki ◽

Toshiaki Tanaka ◽

Akihiro Uenishi ◽

Kazuyoshi Shiomi

Keyword(s):

Surface Roughness ◽

Dielectric Loss ◽

Loss Tangent ◽

Dielectric Loss Tangent ◽

Electrical Insulation ◽

Insulation Material ◽

Low Dielectric

Download Full-text

Challenges and approaches of TSV thin die stacking on organic substrate

2011 IEEE 13th Electronics Packaging Technology Conference ◽

10.1109/eptc.2011.6184464 ◽

2011 ◽

Cited By ~ 4

Author(s):

Sharon Lim Pei-Siang ◽

Che Faxing ◽

Chong Ser Choong ◽

Michelle Chew Bi Rong ◽

Vasarla Nagendra Sekhar ◽

...

Keyword(s):

Organic Substrate ◽

Die Stacking

Download Full-text

Development for VCI (Vertical Circuit Interconnection) technology for stacked die package

2011 IEEE 13th Electronics Packaging Technology Conference ◽

10.1109/eptc.2011.6184440 ◽

2011 ◽

Cited By ~ 2

Author(s):

Ivan Chang ◽

Jensen Tsai ◽

James Chiang ◽

Daniel Liu ◽

FL Tsai ◽

...

Download Full-text

Evaluation and optimization of die-shift in Embedded Wafer-Level Packaging by enhancing the adhesion strength of silicon chips to carrier wafer

2011 IEEE 13th Electronics Packaging Technology Conference ◽

10.1109/eptc.2011.6184519 ◽

2011 ◽

Cited By ~ 17

Author(s):

J. Mazuir ◽

V. Olmeta ◽

M. Yin ◽

G. Pares ◽

A. Planchais ◽

...

Keyword(s):

Adhesion Strength ◽

Wafer Level ◽

Silicon Chips ◽

Wafer Level Packaging ◽

Carrier Wafer

Download Full-text

Challenges of Pd-coated Cu wire bonding on C65 Al bond pad low-k wafer with BOA structure

2011 IEEE 13th Electronics Packaging Technology Conference ◽

10.1109/eptc.2011.6184452 ◽

2011 ◽

Author(s):

Chan Kheng Jin ◽

Ng Bee Poh Christine ◽

Chong Mong Ting ◽

Dan Swee Tong

Keyword(s):

Wire Bonding ◽

Low K

Download Full-text

Measurement methods for curing properties of resin considering process condition and effects on package

2011 IEEE 13th Electronics Packaging Technology Conference ◽

10.1109/eptc.2011.6184445 ◽

2011 ◽

Author(s):

Tomohiko Takeda ◽

Qiang Yu

Keyword(s):

Process Condition ◽

Measurement Methods

Download Full-text

2011 IEEE 13th Electronics Packaging Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal performance evaluation of a synthetic jet heat sink for electronic cooling

A simplified approach to simulate bubble nucleation in flow boiling

Reliability of copper wire bonding in humidity environment

Effect of microstructure on thermal-mechanical stress in 3D copper TSV structures

Build-up electrical insulation material with low-dielectric loss tangent, low-CTE and low-surface roughness

Challenges and approaches of TSV thin die stacking on organic substrate

Development for VCI (Vertical Circuit Interconnection) technology for stacked die package

Evaluation and optimization of die-shift in Embedded Wafer-Level Packaging by enhancing the adhesion strength of silicon chips to carrier wafer

Challenges of Pd-coated Cu wire bonding on C65 Al bond pad low-k wafer with BOA structure

Measurement methods for curing properties of resin considering process condition and effects on package

2011 IEEE 13th Electronics Packaging Technology Conference
Latest Publications