2011 IEEE 13th Electronics Packaging Technology Conference
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9781457719820, 9781457719837, 9781457719813
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

MEMS technology on wafer-lever LED packaging

2011 ◽  
Author(s):  
Chunming Chang ◽  
Chenghan Huang ◽  
Tenghsien Lai ◽  
Chingfu Tsou ◽  
Thong-Shing Hwang ◽  
...  
Keyword(s):  
Mems Technology

Challenges and approaches of TSV thin die stacking on organic substrate

2011 ◽  
Author(s):  
Sharon Lim Pei-Siang ◽  
Che Faxing ◽  
Chong Ser Choong ◽  
Michelle Chew Bi Rong ◽  
Vasarla Nagendra Sekhar ◽  
...  
Keyword(s):  
Organic Substrate ◽  
Die Stacking

Development for VCI (Vertical Circuit Interconnection) technology for stacked die package

2011 ◽  
Author(s):  
Ivan Chang ◽  
Jensen Tsai ◽  
James Chiang ◽  
Daniel Liu ◽  
FL Tsai ◽  
...  

Challenges of Pd-coated Cu wire bonding on C65 Al bond pad low-k wafer with BOA structure

2011 ◽  
Author(s):  
Chan Kheng Jin ◽  
Ng Bee Poh Christine ◽  
Chong Mong Ting ◽  
Dan Swee Tong
Keyword(s):  
Wire Bonding ◽  
Low K

A simplified approach to simulate bubble nucleation in flow boiling

2011 ◽  
Author(s):  
X. Q. Xing ◽  
Y. J. Lee ◽  
Y. Y. Hoe ◽  
X. Zhang ◽  
S. Gao ◽  
...  
Keyword(s):  
Flow Boiling ◽  
Bubble Nucleation ◽  
Simplified Approach

Reliability of copper wire bonding in humidity environment

2011 ◽  
Author(s):  
Hai Liu ◽  
Zhenqing Zhao ◽  
Qiang Chen ◽  
Jianwei Zhou ◽  
Maohua Du ◽  
...  
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Copper Wire Bonding ◽  
Humidity Environment
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