Mechanical and materials modeling/simulation/verification trend for electronics packaging products

Author(s):  
C.K. Lim
2007 ◽  
pp. 50-57
Author(s):  
Maria Samaras ◽  
Wolfgang Hoffelner ◽  
Chu Chun Fu ◽  
Michel Guttmann ◽  
Roger E. Stoller

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