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Mechanical and materials modeling/simulation/verification trend for electronics packaging products
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)
◽
10.1109/ectc.1993.346834
◽
2002
◽
Cited By ~ 1
Author(s):
C.K. Lim
Keyword(s):
Electronics Packaging
◽
Modeling Simulation
◽
Materials Modeling
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1997
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M. Gregory Forest
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Technological Application
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Microstructures and Properties of High‐Entropy Materials: Modeling, Simulation, and Experiments
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Thermo-Mechanical Behavior of Functionally Graded Materials: Modeling, Simulation and Error Estimation
Mechanics of Advanced Materials and Structures
◽
10.1080/15376494.2010.519221
◽
2011
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Revue Générale Nucléaire
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10.1051/rgn/20075050
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◽
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◽
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2004
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