Understanding the process window for printing lead-free solder pastes

2002 ◽  
Author(s):  
T.A. Nguty ◽  
S. Budiman ◽  
D. Rajkumar ◽  
R. Solomon ◽  
N.N. Ekere ◽  
...  
Keyword(s):  
Lead Free ◽  
Process Window ◽  
Lead Free Solder ◽  
Solder Pastes ◽  
Free Solder

Understanding the process window for printing lead-free solder pastes

2001 ◽  
Vol 24 (4) ◽  
pp. 249-254 ◽  
Author(s):  
T.A. Nguty ◽  
B. Salam ◽  
R. Durairaj ◽  
N.N. Ekere
Keyword(s):  
Lead Free ◽  
Process Window ◽  
Lead Free Solder ◽  
Solder Pastes ◽  
Free Solder

Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package

2007 ◽  
Vol 4 (3) ◽  
pp. 112-120 ◽  
Author(s):  
John Lau ◽  
Todd Castello ◽  
Dongkai Shangguan ◽  
Walter Dauksher ◽  
Joe Smetana ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Surface Finish ◽  
Failure Modes ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Organic Solderability Preservative ◽  
Solder Pastes ◽  
Free Solder

In this study, failure analysis of the 1657CCGA package with 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb solder pastes on lead-free PCBs with the Entek OSP (organic solderability preservative) surface finish is investigated. Emphasis is placed on determining the failure locations and failure modes of the solder joints of the 1657CCGA assemblies after they have been through 7,000 cycles of temperature cycling.

Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

2011 ◽  
Author(s):  
S. Mallik ◽  
R. Bauer ◽  
F. Hübner ◽  
N. N. Ekere ◽  
Francisco Chinesta ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Assembly Process ◽  
Electronics Assembly ◽  
Solder Pastes ◽  
Free Solder

Solder balling of lead-free solder pastes

2002 ◽  
Vol 31 (11) ◽  
pp. 1130-1138 ◽  
Author(s):  
Minna Arra ◽  
Dongkai Shangguan ◽  
Erro Ristolainen ◽  
Toivo Lepistö
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Solder Pastes ◽  
Free Solder
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