2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
Latest Publications

TOTAL DOCUMENTS

286

(FIVE YEARS 0)

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(FIVE YEARS 0)

Published By IEEE

0780359089

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Study of reliability and process ability for preset underfill sheet material as future standard flip chip packaging process

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853170 ◽

2002 ◽

Cited By ~ 4

Author(s):

H. Noro ◽

M. Mizutani ◽

M. Kuwamura ◽

H. Usui ◽

S. Ito

Keyword(s):

Flip Chip ◽

Sheet Material ◽

Packaging Process ◽

Flip Chip Packaging ◽

Process Ability

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Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853224 ◽

2002 ◽

Cited By ~ 19

Author(s):

A. Schubert ◽

R. Dudek ◽

J. Kloeser ◽

B. Michel ◽

H. Reichl ◽

...

Keyword(s):

Induced Defects

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Investigation on effect of coupling agents in epoxy based underfill material for flip chip application

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853169 ◽

2002 ◽

Cited By ~ 1

Author(s):

Shijian Luo ◽

C.P. Wong

Keyword(s):

Flip Chip ◽

Coupling Agents ◽

Underfill Material

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Predictive reliability modeling for flipchip interconnect bump extrusion

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853223 ◽

2002 ◽

Cited By ~ 2

Author(s):

A.E. Lucero ◽

R. Dias ◽

T. Pavey

Keyword(s):

Reliability Modeling

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Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard small outline packages

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853192 ◽

2002 ◽

Cited By ~ 5

Author(s):

T.S. Horng ◽

S.M. Wu ◽

J.Y. Li ◽

C.T. Chiu ◽

C.P. Hung

Keyword(s):

Electrical Performance ◽

Performance Improvements ◽

Chip Carrier

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A new method to interconnect PCB layers in GHz frequency range

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853191 ◽

2002 ◽

Cited By ~ 1

Author(s):

S. Kiani ◽

M. Khusid

Keyword(s):

New Method ◽

Frequency Range

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Accurate measurement and characterization up to 50 GHz of CPW-based integrated passives in microwave MCM-D

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853196 ◽

2002 ◽

Cited By ~ 12

Author(s):

G. Carchon ◽

S. Brebels ◽

W. De Raedt ◽

B. Neuwelaers

Keyword(s):

Integrated Passives

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Study on metal adhesion mechanisms in high density interconnect printed circuit boards

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853212 ◽

2002 ◽

Cited By ~ 1

Author(s):

L.J. Martin ◽

C.P. Wong

Keyword(s):

Printed Circuit Boards ◽

High Density ◽

Circuit Boards ◽

Printed Circuit

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High frequency performance of integral capacitors in cofired ceramic substrates

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853195 ◽

2002 ◽

Cited By ~ 1

Author(s):

Y. Taguchi ◽

M. Itagaki ◽

O. Inoue ◽

J. Kato ◽

K. Eda

Keyword(s):

High Frequency ◽

Ceramic Substrates ◽

High Frequency Performance

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The application of HITCE ceramic material for LGA-type chip scale package

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853177 ◽

2002 ◽

Cited By ~ 10

Author(s):

K. Maeda ◽

M. Higashi ◽

M. Kokubu ◽

S. Nakagawa

Keyword(s):

Ceramic Material ◽

Chip Scale Package

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2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Study of reliability and process ability for preset underfill sheet material as future standard flip chip packaging process

Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects

Investigation on effect of coupling agents in epoxy based underfill material for flip chip application

Predictive reliability modeling for flipchip interconnect bump extrusion

Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard small outline packages

A new method to interconnect PCB layers in GHz frequency range

Accurate measurement and characterization up to 50 GHz of CPW-based integrated passives in microwave MCM-D

Study on metal adhesion mechanisms in high density interconnect printed circuit boards

High frequency performance of integral capacitors in cofired ceramic substrates

The application of HITCE ceramic material for LGA-type chip scale package

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
Latest Publications