Lead-free Solders
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Published By ASTM International

9780803175167
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint

2011 ◽  
pp. 121-121-18
Author(s):  
Feng Gao ◽  
Jianping Jing ◽  
Frank Z. Liang ◽  
Richard L. Williams ◽  
Jianmin Qu
Keyword(s):  
Solder Joint ◽  
Failure Mode ◽  
Lead Free ◽  
Lead Free Solder ◽  
Interfacial Failure ◽  
Free Solder

Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

2011 ◽  
pp. 74-74-15 ◽  
Author(s):  
Weiqiang Wang ◽  
Michael Osterman ◽  
Diganta Das ◽  
Michael Pecht
Keyword(s):  
Solder Joint ◽  
Temperature Cycling ◽  
Lead Frame ◽  
Solder Joint Reliability ◽  
Joint Reliability

Tensile Properties of Sn-10Sb-5Cu High Temperature Lead Free Solder

2011 ◽  
pp. 158-158-10
Author(s):  
Qiulian Zeng ◽  
Jianjun Guo ◽  
Xiaolong Gu ◽  
Qingsheng Zhu ◽  
Xiaogang Liu
Keyword(s):  
High Temperature ◽  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Wetting Behavior of Solders

2011 ◽  
pp. 1-1-26
Author(s):  
Girish Kumar ◽  
K. Narayan Prabhu
Keyword(s):  
Wetting Behavior
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