Rheological Characterisation and Empirical Modelling of Lead-Free Solder Pastes and Isotropic Conductive Adhesive Pastes

2011 ◽  
pp. 186-186-18
Author(s):  
R. Durairaj ◽  
Lam Wai Man ◽  
S. Ramesh
Keyword(s):  
Conductive Adhesive ◽  
Lead Free ◽  
Lead Free Solder ◽  
Empirical Modelling ◽  
Isotropic Conductive Adhesive ◽  
Solder Pastes ◽  
Free Solder

Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package

2007 ◽  
Vol 4 (3) ◽  
pp. 112-120 ◽  
Author(s):  
John Lau ◽  
Todd Castello ◽  
Dongkai Shangguan ◽  
Walter Dauksher ◽  
Joe Smetana ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Surface Finish ◽  
Failure Modes ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Organic Solderability Preservative ◽  
Solder Pastes ◽  
Free Solder

In this study, failure analysis of the 1657CCGA package with 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb solder pastes on lead-free PCBs with the Entek OSP (organic solderability preservative) surface finish is investigated. Emphasis is placed on determining the failure locations and failure modes of the solder joints of the 1657CCGA assemblies after they have been through 7,000 cycles of temperature cycling.

Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

2011 ◽  
Author(s):  
S. Mallik ◽  
R. Bauer ◽  
F. Hübner ◽  
N. N. Ekere ◽  
Francisco Chinesta ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Assembly Process ◽  
Electronics Assembly ◽  
Solder Pastes ◽  
Free Solder

Solder balling of lead-free solder pastes

2002 ◽  
Vol 31 (11) ◽  
pp. 1130-1138 ◽  
Author(s):  
Minna Arra ◽  
Dongkai Shangguan ◽  
Erro Ristolainen ◽  
Toivo Lepistö
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Solder Pastes ◽  
Free Solder

Real-time Observation of Hydrogen Plasma Reflow Process with Lead-free Solder Pastes

2006 ◽  
Author(s):  
Shuichi Nishi ◽  
Eiji Higurashi ◽  
Tadatomo Suga ◽  
Taizoh Hagihara ◽  
Tatsuya Takeuchi ◽  
...  
Keyword(s):  
Real Time ◽  
Hydrogen Plasma ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Process ◽  
Solder Pastes ◽  
Time Observation ◽  
Free Solder ◽  
Real Time Observation
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