2008 10th Electronics Packaging Technology Conference
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243
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Published By IEEE

9781424421176, 9781424421183
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Study of Sn-Bi-Cu Lead-free Solder

2008 ◽  
Author(s):  
Hu-qiang Xu-jun ◽  
He hui-jun ◽  
Zhang fu-wen ◽  
Zhao zhao-hui
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Improved Microwave Modeling of CMOS Spiral Inductors with Metal Dummy Fills

2008 ◽  
Author(s):  
Lan Nan ◽  
Koen Mouthaan ◽  
Yong-Zhong Xiong ◽  
Jinglin Shi ◽  
Subhash Chander Rustagi ◽  
...  
Keyword(s):  
Spiral Inductors

Evaluation of Reliability of Metal Films/Multilayers

2008 ◽  
Author(s):  
G. P. Zhang ◽  
X. F. Zhu ◽  
Y. P. Li
Keyword(s):  
Metal Films

Parametric Analysis of Embedded EBG Structures for Noise Suppression Applications

2008 ◽  
Author(s):  
Y.T. Ng ◽  
L.L. Wai ◽  
W. Fan ◽  
P.W. Gian ◽  
H. Lu ◽  
...  
Keyword(s):  
Parametric Analysis ◽  
Noise Suppression

Epoxy Die Attach Challenges in Miniature and Compact DFN / QFN Packages

2008 ◽  
Author(s):  
Chin Lap Sin ◽  
Tan Chee Eng ◽  
Mohd Syahril Amiruddin ◽  
Tan Seng Lee
Keyword(s):  
Die Attach

Thermal and Hydraulic Design and Characterization of a Liquid-Cooled 3D Silicon Module

2008 ◽  
Author(s):  
S.P. Tan ◽  
K.C. Toh ◽  
Navas Khan ◽  
Tang Gong Yue ◽  
Pinjala Damaruganath ◽  
...  
Keyword(s):  
Hydraulic Design

Fluxless Flip-Chip Bonding Process Using Hydrogen Radical

2008 ◽  
Author(s):  
Taizo Hagihara ◽  
Tatsuya Takeuchi ◽  
Yasuhide Ohno
Keyword(s):  
Flip Chip ◽  
Bonding Process ◽  
Flip Chip Bonding ◽  
Hydrogen Radical

2N Wire for Ultra Fine Pitch Wire Bonding: Challenges & Solutions

2008 ◽  
Author(s):  
June Sub Hwang ◽  
Balasubramanian Senthil Kumar ◽  
Jeong Tak Moon ◽  
Chul Uhm ◽  
Yu Na Kim ◽  
...  
Keyword(s):  
Wire Bonding ◽  
Fine Pitch

Analysis of Thermal Performance of High Power Light Emitting Diodes Package

2008 ◽  
Author(s):  
Wei-Hao Chi ◽  
Tsung-Lin Chou ◽  
Cheng-Nan Han ◽  
Kuo-Ning Chiang
Keyword(s):  
Thermal Performance ◽  
High Power ◽  
Light Emitting Diodes ◽  
Light Emitting
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