Double-Densified Vertically Aligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects
Keyword(s):
2006 ◽
Vol 35
(2)
◽
pp. 195-199
◽
2011 ◽
Vol 13
(3)
◽
pp. 302-305
◽
Keyword(s):
2005 ◽
Vol 2005.1
(0)
◽
pp. 553-554