Study on residual stress in viscoelastic thin film using curvature measurement method

2002 ◽  
Author(s):  
Y.T. Im ◽  
J.H. Kim ◽  
S.T. Choi
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Measurement Method ◽  
Curvature Measurement

Study on residual stress in viscoelastic thin film using curvature measurement method

2004 ◽  
Vol 18 (1) ◽  
Author(s):  
Young Tae Im ◽  
Seung Tae Choi ◽  
Tae Sang Park ◽  
Jae Hyun Kim
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Measurement Method ◽  
Curvature Measurement

Kinetic analysis and correlation with residual stress of the Ni/Si system in thin film

2005 ◽  
Vol 875 ◽  
Author(s):  
F. Cacho ◽  
D. Aime ◽  
F. Wacquant ◽  
B. Froment ◽  
C. Rivero ◽  
...  
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Kinetic Model ◽  
Sheet Resistance ◽  
Annealing Temperature ◽  
Silicon Crystal ◽  
Reactive Diffusion ◽  
Curvature Measurement ◽  
Multiphase Diffusion ◽  
Resistance Data

AbstractReactive diffusion of the Ni/Si system has been studied by annealing nickel thin film on (100) silicon crystal. The measurement of the NiSi sheet resistance as a function of the annealing temperature and the type of annealing (Rapid Thermal Annealing and spike one) has been investigated. A kinetic model based on multiphase diffusion has been developed that fits experimental sheet resistance data. Residual stress in the thin film, measured by a curvature measurement technique, is correlated with the nature of the phases in the film. Finally the viscoplastic mechanical behavior of the Ni2Si and NiSi phases is analyzed in the case of low and fast thermal ramps.

scholarly journals A harmless thin film elastic modulus measurement method through bending the nonlinear sliding cantilever beam

Measurement ◽  
2021 ◽  
Vol 175 ◽  
pp. 108984
Author(s):  
Jianhua Tang ◽  
Lezhang Liu ◽  
Li Jiang ◽  
Hui Huang ◽  
Qiongyao Wang
Keyword(s):  
Thin Film ◽  
Elastic Modulus ◽  
Cantilever Beam ◽  
Measurement Method ◽  
Modulus Measurement

Measurements of Residual Stress in the Layers of Thin Film Micro-Gas Sensors

2000 ◽  
Vol 657 ◽  
Author(s):  
Youngman Kim ◽  
Sung-Ho Choo
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Gas Sensor ◽  
Gas Sensors ◽  
Micro Gas Sensor ◽  
Thin Film Layer ◽  
Film Layer ◽  
The Difference ◽  
Stress States

ABSTRACTThe mechanical properties of thin film materials are known to be different from those of bulk materials, which are generally overlooked in practice. The difference in mechanical properties can be misleading in the estimation of residual stress states in micro-gas sensors with multi-layer structures during manufacturing and in service.In this study the residual stress of each film layer in a micro-gas sensor was measured according to the five difference sets of film stacking structure used for the sensor. The Pt thin film layer was found to have the highest tensile residual stress, which may affect the reliability of the micro-gas sensor. For the Pt layer the changes in residual stress were measured as a function of processing variables and thermal cycling.

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