Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506)
Latest Publications

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(FIVE YEARS 0)

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Published By IEEE

0780371577

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Study on microstructure and shear strength of Sn-Ag-Sb solder joints

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) ◽

10.1109/emap.2001.984003 ◽

2002 ◽

Author(s):

Hwa-Teng Lee ◽

Tain-Long Liao ◽

Ming-Hung Chen

Keyword(s):

Shear Strength ◽

Solder Joints

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Prospects of system IC semiconductor industry

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) ◽

10.1109/emap.2001.983950 ◽

2002 ◽

Author(s):

Youm Huh

Keyword(s):

Semiconductor Industry

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Chemo-thermo-viscoelastic behavior of underfill materials during curing process

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) ◽

10.1109/emap.2001.983994 ◽

2002 ◽

Author(s):

Sung Yi ◽

Kerm Sin Chian

Keyword(s):

Viscoelastic Behavior ◽

Curing Process

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Evaluation of thermal shear strains in flip-chip package by electronic speckle pattern interferometry (ESPI)

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) ◽

10.1109/emap.2001.984002 ◽

2002 ◽

Cited By ~ 1

Author(s):

Woosoon Jang ◽

Baik-Woo Lee ◽

Dong-Won Kim ◽

Jae-Woong Nah ◽

Kyung-Wook Paik ◽

...

Keyword(s):

Flip Chip ◽

Speckle Pattern ◽

Electronic Speckle Pattern Interferometry ◽

Shear Strains

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The effect of ultrasonic power on bonding pad and IMD layers in ultrasonic wire bonding

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) ◽

10.1109/emap.2001.983991 ◽

2002 ◽

Author(s):

Insu Jeon ◽

Qwanho Chung ◽

Joonki Hong ◽

Kwangyoo Byun

Keyword(s):

Wire Bonding ◽

Ultrasonic Power ◽

Ultrasonic Wire Bonding

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Thermo-mechanical and flexural behavior of WB-PBGA package using moire interferometry

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) ◽

10.1109/emap.2001.984021 ◽

2002 ◽

Author(s):

Jinwon Joo ◽

Kihwan Oh ◽

Seungmin Cho ◽

Bongtae Han

Keyword(s):

Moiré Interferometry ◽

Flexural Behavior ◽

Moire Interferometry

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Intermetallic formation in the Sn-Ag solder joints between Au stud bumps and Cu pads and its effect on the chip shear strength

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) ◽

10.1109/emap.2001.983976 ◽

2002 ◽

Cited By ~ 2

Author(s):

Mu-Seob Shin ◽

Young-Ho Kim

Keyword(s):

Shear Strength ◽

Solder Joints ◽

Intermetallic Formation

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High- reliability nonconductive adhesives for flip chip interconnections

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) ◽

10.1109/emap.2001.983954 ◽

2002 ◽

Cited By ~ 1

Author(s):

Woon-Seong Kwon ◽

Kyung-Woon Jang ◽

Kyung-Wook Paik ◽

Myung-Jin Yim ◽

Jin-Sang Hwang

Keyword(s):

Flip Chip ◽

High Reliability

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The study of failure mechanism and chip warpage for DCA components

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) ◽

10.1109/emap.2001.984010 ◽

2002 ◽

Author(s):

C.Y. Huang ◽

J.R. Lin ◽

K. Srihari

Keyword(s):

Failure Mechanism

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Study on coined solder bumps on micro-via PCBs

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) ◽

10.1109/emap.2001.983969 ◽

2002 ◽

Author(s):

Jae-Woong Nah ◽

K.W. Paik ◽

Won-Hoe Kim ◽

Ki-Rok Hur

Keyword(s):

Solder Bumps

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Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Study on microstructure and shear strength of Sn-Ag-Sb solder joints

Prospects of system IC semiconductor industry

Chemo-thermo-viscoelastic behavior of underfill materials during curing process

Evaluation of thermal shear strains in flip-chip package by electronic speckle pattern interferometry (ESPI)

The effect of ultrasonic power on bonding pad and IMD layers in ultrasonic wire bonding

Thermo-mechanical and flexural behavior of WB-PBGA package using moire interferometry

Intermetallic formation in the Sn-Ag solder joints between Au stud bumps and Cu pads and its effect on the chip shear strength

High- reliability nonconductive adhesives for flip chip interconnections

The study of failure mechanism and chip warpage for DCA components

Study on coined solder bumps on micro-via PCBs

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506)
Latest Publications