Security Assessment and Reliability Improvement with considering Demand Response

2021 ◽  
Author(s):  
Farhad Amin ◽  
Mohammad Mahdi Borhan Elmi
Keyword(s):  
Demand Response ◽  
Security Assessment ◽  
Reliability Improvement

Online voltage security assessment considering comfort-constrained demand response control of distributed heat pump systems

2012 ◽  
Vol 96 ◽  
pp. 104-114 ◽  
Author(s):  
D. Wang ◽  
S. Parkinson ◽  
W. Miao ◽  
H. Jia ◽  
C. Crawford ◽  
...  
Keyword(s):  
Heat Pump ◽  
Demand Response ◽  
Security Assessment ◽  
Response Control ◽  
Voltage Security

Reliability Improvement of Ground Fault Protection System Using an S-Type Horn Attachment Gap in AC Feeding System

2009 ◽  
Vol 129 (10) ◽  
pp. 949-956
Author(s):  
Kohji Ajiki ◽  
Hiroaki Morimoto ◽  
Fumiyuki Shimokawa ◽  
Shinya Sakai ◽  
Kazuomi Sasaki ◽  
...  
Keyword(s):  
Protection System ◽  
Feeding System ◽  
Reliability Improvement ◽  
Ground Fault ◽  
Fault Protection ◽  
Ground Fault Protection

Load Controllability Evaluation Modeling for Demand Response Potential Estimation

2017 ◽  
Vol 137 (5) ◽  
pp. 372-380 ◽  
Author(s):  
Yutaka Iino ◽  
Tsutomu Fujikawa ◽  
Saori Kaneko ◽  
Gaku Shimoda ◽  
Kazuto Kataoka ◽  
...  
Keyword(s):  
Demand Response

An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages

2009 ◽  
Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai
Keyword(s):  
Thermal Stress ◽  
Failure Analysis ◽  
Deformation Measurement ◽  
Stress Conditions ◽  
Analysis Approach ◽  
New Approach ◽  
Reliability Improvement

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.

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