Next generation I/O power delivery design through SIPD co-analysis & comprehensive platform validation

2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2009.5338441 ◽

2009 ◽

Author(s):

Yee Hung See Tau ◽

Marcus Chan

Keyword(s):

Power Delivery ◽

Next Generation

Coreless Substrate Design, Assembly and Reliability for High Speed Applications

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2010dpc-wa35 ◽

2010 ◽

Vol 2010 (DPC) ◽

pp. 001486-001513

Author(s):

Jon Aday ◽

Nozad Karim ◽

Mike Devita ◽

Steven Lee

Keyword(s):

High Speed ◽

Flip Chip ◽

Core Layer ◽

Power Delivery ◽

Advanced Materials ◽

Band Width ◽

Electrical Performance ◽

Next Generation ◽

Reliability Data ◽

The Core

There are 2 primary drivers for advanced substrate technologies to support the next generation of products. One driver is silicon designs which are shifting to 20–40 GBit applications. The band width of these products are requiring advanced materials, and designs which use much thinner cores making routing and manufacturing of these packages easier. The second driver is the move more advanced silicon nodes which also drives the importance for much better power delivery. Coreless substrates enable both of these applications by eliminating the core layer which enables much finner via pitchs to route signals and power/gnd planes. The thinness also reduces the bandwidth used up by the substrate which also enables better electrical performance. This paper will focus on the electrical drivers including simulation to support the structure, flip chip assembly of the package as well as the reliability data associated with the assembly.

Power Delivery Network Design Strategy for Next Generation High Speed IO

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680860 ◽

2018 ◽

Author(s):

Mukesh Moorthy ◽

Manjunath Jayasimha

Keyword(s):

Network Design ◽

High Speed ◽

Design Strategy ◽

Power Delivery ◽

Next Generation ◽

Power Delivery Network ◽

Delivery Network