2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Latest Publications

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54

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2

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Published By IEEE

9781538665923

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Non-Periodic Flipped-SIR EBG for Dual-Band SSN Mitigation in 2-Layer PCB

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680868 ◽

2018 ◽

Author(s):

Yu-Cong Wang ◽

Hao-Wei Chan ◽

Hsin-Chan Hsieh ◽

Ying-Hsi Lin ◽

Wen-Shan Wang ◽

...

Keyword(s):

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Signal Integrity Analysis on High-Density Silicon Interposer Package Technology for Next Generation Applications

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680900 ◽

2018 ◽

Author(s):

Surender Singh ◽

Ashish Gupta

Keyword(s):

Signal Integrity ◽

High Density ◽

Next Generation ◽

Integrity Analysis

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A novel on-chip mismatch measurement technique for Nyquist rate ADCs

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680875 ◽

2018 ◽

Author(s):

Ankur BAL ◽

Vikram SINGH

Keyword(s):

Measurement Technique ◽

Nyquist Rate ◽

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Phase Change Material Compact Model: Validation and Sensitivity as Thermal Interface Material

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680873 ◽

2018 ◽

Author(s):

Javed Shaikh ◽

Je-Young Chang ◽

Weihua Tang

Keyword(s):

Phase Change ◽

Phase Change Material ◽

Model Validation ◽

Thermal Interface Material ◽

Compact Model ◽

Thermal Interface ◽

Change Material

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Paper [Program]

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680859 ◽

2018 ◽

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Preliminary Application of Deep Learning to Design Space Exploration

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680888 ◽

2018 ◽

Author(s):

Kallol Roy ◽

Hakki Torun Mert ◽

Madhavan Swaminathan

Keyword(s):

Deep Learning ◽

Design Space Exploration ◽

Design Space ◽

Space Exploration ◽

Preliminary Application

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Impact of MWCNT Radii on the Performance of Nano Regime Interconnects

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680886 ◽

2018 ◽

Author(s):

Amit Kumar ◽

Brajesh Kumar Kaushik

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Power Supply Noise Coupling Mitigation across High Speed Serial Links

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680880 ◽

2018 ◽

Author(s):

Manjunath Jayasimha ◽

Mukesh Moorthy

Keyword(s):

Power Supply ◽

Power Supply Noise ◽

Serial Links ◽

Noise Coupling ◽

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A Quick Assessment of Nonlinearity in Power Delivery Networks

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680881 ◽

2018 ◽

Author(s):

Vijender Kumar Sharma ◽

Jai Narayan Tripathi ◽

Hitesh Shrimali

Keyword(s):

Power Delivery ◽

Power Delivery Networks ◽

Quick Assessment ◽

Delivery Networks

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Power Delivery Network Design Strategy for Next Generation High Speed IO

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680860 ◽

2018 ◽

Author(s):

Mukesh Moorthy ◽

Manjunath Jayasimha

Keyword(s):

Network Design ◽

Design Strategy ◽

Power Delivery ◽

Next Generation ◽

Power Delivery Network ◽

Delivery Network

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