Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO2 interface

Author(s):  
O. Holck ◽  
E. Dermitzaki ◽  
B. Wunderle ◽  
J. Bauer ◽  
B. Michel
2011 ◽  
Vol 51 (6) ◽  
pp. 1027-1034 ◽  
Author(s):  
O. Hölck ◽  
E. Dermitzaki ◽  
B. Wunderle ◽  
J. Bauer ◽  
B. Michel

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