Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO2 interface
2011 ◽
Vol 51
(6)
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pp. 1027-1034
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2007 ◽
Vol 46
(3)
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pp. 205-212
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2019 ◽
Vol 225
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pp. 510-525
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2009 ◽
Vol 34
(1/2)
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pp. 139
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Keyword(s):
2018 ◽
Vol 5
(1)
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pp. 2163-2170
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Keyword(s):
2012 ◽
Vol 11
(11)
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pp. 1095-1110
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