Coupling capacitance extraction in through-silicon via (TSV) arrays
2015 ◽
Vol 135
(7)
◽
pp. 744-751
2017 ◽
Vol 14
(15)
◽
pp. 20170559-20170559
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Keyword(s):
2017 ◽
Vol E100.C
(12)
◽
pp. 1108-1117
◽
Keyword(s):