The solder volume effect on the creep behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints

2011 ◽  
Author(s):  
Li Xun-Ping ◽  
Xia Jian-Min ◽  
Zhang Xin-Ping
Keyword(s):  
Creep Behavior ◽  
Volume Effect ◽  
Solder Volume

scholarly journals Solder Volume Effect on Interfacial Reaction between Sn-Ag-Cu/ENImAg Substrate

2017 ◽  
Vol 184 ◽  
pp. 604-610
Author(s):  
M.A. Rabiatul Adawiyah ◽  
O. Saliza Azlina
Keyword(s):  
Interfacial Reaction ◽  
Volume Effect ◽  
Solder Volume

Solder Volume Effect on Electromigration Failure Mechanism of Cu/Ni/Sn-Ag Microbumps

2020 ◽  
Vol 10 (10) ◽  
pp. 1589-1593
Author(s):  
Young-Bae Park ◽  
Gyu-Tae Park ◽  
Byeong-Rok Lee ◽  
Jun-Beom Kim ◽  
Kirak Son
Keyword(s):  
Failure Mechanism ◽  
Volume Effect ◽  
Solder Volume

scholarly journals Solder Volume Effect on the Microstructure of Solder Joints Using Au/Pd(P)/Ni(P) Surface Finish

2012 ◽  
Vol 36 ◽  
pp. 419-426 ◽  
Author(s):  
Wei–Hsiang Wu ◽  
Sheng–Wei Lin ◽  
Yen–Chen Lin ◽  
Cheng–En Ho
Keyword(s):  
Surface Finish ◽  
Solder Joints ◽  
Volume Effect ◽  
Solder Volume

Manofluorographic Analysis of Bolus Volume Effect in Normal Swallowing

2006 ◽  
Vol 57 (4) ◽  
pp. 351-362 ◽  
Author(s):  
Yuko Matsumura ◽  
Takehiro Karaho ◽  
Tetsuya Tanabe ◽  
Satoshi Kitahara
Keyword(s):  
Volume Effect ◽  
Bolus Volume ◽  
Normal Swallowing

COMPRESSIVE CREEP BEHAVIOR OF REACTORCONTROL ROD MATERIAL Ag-In-Cd ALLOY

2013 ◽  
Vol 49 (8) ◽  
pp. 1012 ◽  
Author(s):  
Hongxing XIAO ◽  
Chongsheng LONG ◽  
Le CHEN ◽  
Bo LIANG
Keyword(s):  
Creep Behavior ◽  
Compressive Creep
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