Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583286 ◽

2016 ◽

Author(s):

Shui-Bao Liang ◽

Chang-Bo Ke ◽

Min-Bo Zhou ◽

Xin-Ping Zhang

Keyword(s):

Temperature Gradient ◽

Phase Field ◽

Morphological Evolution ◽

Small Scale ◽

Phase Field Simulation ◽

Solder Interconnects ◽

Field Simulation ◽

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Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236589 ◽

2015 ◽

Author(s):

Shui-Bao Liang ◽

Chang-Bo Ke ◽

Min-Bo Zhou ◽

Xin-Ping Zhang

Keyword(s):

Phase Field ◽

Morphological Evolution ◽

Migration Behavior ◽

Electrical Field ◽

Phase Field Simulation ◽

Cu Interconnects ◽

Field Simulation ◽

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Investigation on temperature-gradient-driven effects in unconventional sintering via non-isothermal phase-field simulation

Scripta Materialia ◽

10.1016/j.scriptamat.2020.05.016 ◽

2020 ◽

Vol 186 ◽

pp. 152-157

Author(s):

Yangyiwei Yang ◽

Timileyin David Oyedeji ◽

Patrick Kühn ◽

Bai-Xiang Xu

Keyword(s):

Temperature Gradient ◽

Phase Field ◽

Phase Field Simulation ◽

Field Simulation

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Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient

Microelectronics Reliability ◽

10.1016/j.microrel.2018.11.007 ◽

2019 ◽

Vol 92 ◽

pp. 1-11 ◽

Author(s):

S.B. Liang ◽

C.B. Ke ◽

J.Q. Huang ◽

M.B. Zhou ◽

X.P. Zhang

Keyword(s):

Temperature Gradient ◽

Microstructural Evolution ◽

Phase Field ◽

Isothermal Aging ◽

Phase Segregation ◽

Phase Field Simulation ◽

Cu Interconnects ◽

Field Simulation

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Phase field simulation of dendrite growth in binary Ni–Cu alloy under the applied temperature gradient

Computational Materials Science ◽

10.1016/j.commatsci.2016.02.005 ◽

2016 ◽

Vol 117 ◽

pp. 286-293 ◽

Author(s):

X.H. Wu ◽

G. Wang ◽

L.Z. Zhao ◽

D.C. Zeng ◽

Z.W. Liu

Keyword(s):

Temperature Gradient ◽

Phase Field ◽

Dendrite Growth ◽

Phase Field Simulation ◽

Cu Alloy ◽

Field Simulation

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Phase-field simulation of void migration in a temperature gradient

Acta Materialia ◽

10.1016/j.actamat.2010.01.043 ◽

2010 ◽

Vol 58 (9) ◽

pp. 3230-3237 ◽

Author(s):

S.Y. Hu ◽

C.H. Henager Jr.

Keyword(s):

Temperature Gradient ◽

Phase Field ◽

Phase Field Simulation ◽

Field Simulation ◽

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Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583260 ◽

2016 ◽

Author(s):

Shui-Bao Liang ◽

Chang-Bo Ke ◽

Meng-Ying Tan ◽

Min-Bo Zhou ◽

Xin-Ping Zhang

Keyword(s):

Microstructural Evolution ◽

Phase Field ◽

Phase Segregation ◽

Phase Field Simulation ◽

Solder Interconnects ◽

Field Simulation ◽

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Effects of temperature gradient on the interface microstructure and diffusion of diffusion couples: Phase-field simulation

Chinese Physics B ◽

10.1088/1674-1056/24/12/126401 ◽

2015 ◽

Vol 24 (12) ◽

pp. 126401

Author(s):

Yong-Sheng Li ◽

Xing-Chao Wu ◽

Wei Liu ◽

Zhi-Yuan Hou ◽

Hao-Jie Mei

Keyword(s):

Temperature Gradient ◽

Phase Field ◽

Interface Microstructure ◽

Diffusion Couples ◽

Phase Field Simulation ◽

Field Simulation ◽

Effects Of Temperature ◽

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Investigation on Temperature-Gradient-Driven Effects in Unconventional Sintering Via Non-Isothermal Phase-Field Simulation

SSRN Electronic Journal ◽

10.2139/ssrn.3539143 ◽

2020 ◽

Author(s):

Yangyiwei Yang ◽

Timileyin David Oyedeji ◽

Patrick Kühn ◽

Bai-Xiang Xu

Keyword(s):

Temperature Gradient ◽

Phase Field ◽

Phase Field Simulation ◽

Field Simulation

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Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.398 ◽

2016 ◽

Author(s):

Shui-Bao Liang ◽

Chang-Bo Ke ◽

Wen-Jing Ma ◽

Min-Bo Zhou ◽

Xin-Ping Zhang

Keyword(s):

Electric Current ◽

Phase Field ◽

Phase Field Simulation ◽

Solder Interconnects ◽

Field Simulation ◽

Current Stressing

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THREE DIMENSIONAL MULTI--PHASE FIELD SIMULATION OF GROWTH OF EUTECTIC CBr4--C2Cl6 ALLOY I. Modeling and Testing

ACTA METALLURGICA SINICA ◽

10.3724/sp.j.1037.2010.00781 ◽

2010 ◽

Vol 46 (7) ◽

pp. 781-786 ◽

Author(s):

Yujuan YANG ◽

Biao YAN

Keyword(s):

Phase Field ◽

Three Dimensional ◽

Phase Field Simulation ◽

Field Simulation ◽

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