Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient

2019 ◽  
Vol 92 ◽  
pp. 1-11 ◽  
Author(s):  
S.B. Liang ◽  
C.B. Ke ◽  
J.Q. Huang ◽  
M.B. Zhou ◽  
X.P. Zhang
Calphad ◽  
2020 ◽  
Vol 69 ◽  
pp. 101759
Author(s):  
Yuanyang Sun ◽  
Yuhong Zhao ◽  
Baojun Zhao ◽  
Zhen Guo ◽  
Xiaolin Tian ◽  
...  

2012 ◽  
Vol 36 ◽  
pp. 200-206 ◽  
Author(s):  
Weihua Sun ◽  
Senlin Cui ◽  
Lijun Zhang ◽  
Yong Du ◽  
Baiyun Huang

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