Thermal Transient Measurement and Dimension-dependent Modeling of Self-heated Advanced Devices

2021 ◽  
Author(s):  
Zhili Lan ◽  
Renhua Liu ◽  
Xiaojin Li ◽  
Yabin Sun ◽  
Yanling Shi
Keyword(s):  
Thermal Transient ◽  
Transient Measurement

Heat transfer enhancement in MOSFET mounted on different FR4 substrates by thermal transient measurement

2017 ◽  
Vol 26 (9) ◽  
pp. 098901 ◽  
Author(s):  
M S Norazlina ◽  
M K Dheepan Chakravarthii ◽  
S Shanmugan ◽  
D Mutharasu ◽  
Mahmud Shahrom
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Enhancement ◽  
Transfer Enhancement ◽  
Thermal Transient ◽  
Transient Measurement

Thermal transient measurement and modelling of a power cycled flip-chip LED module

2018 ◽  
Vol 81 ◽  
pp. 373-380 ◽  
Author(s):  
Lisa Mitterhuber ◽  
Stefan Defregger ◽  
Julien Magnien ◽  
Jördis Rosc ◽  
René Hammer ◽  
...  
Keyword(s):  
Flip Chip ◽  
Thermal Transient ◽  
Transient Measurement

A new evaluation method of thermal transient measurement results

1997 ◽  
Vol 28 (3) ◽  
pp. 277-292 ◽  
Author(s):  
V. Székely
Keyword(s):  
Evaluation Method ◽  
Measurement Results ◽  
Thermal Transient ◽  
Transient Measurement

Factors that influence thermal transient measurement of high power infrared emitter

2013 ◽  
Author(s):  
Chin-Peng Ching ◽  
Mutharasu Devarajan
Keyword(s):  
High Power ◽  
Infrared Emitter ◽  
Thermal Transient ◽  
Transient Measurement

Thermal Transient Measurements on High Power LEDs with Different MCPCB Substrate

2012 ◽  
Vol 488-489 ◽  
pp. 1363-1368 ◽  
Author(s):  
P. Anithambigai ◽  
D. Mutharasu
Keyword(s):  
Thermal Resistance ◽  
High Power ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Dielectric Material ◽  
Function Evaluation ◽  
Substrate Thickness ◽  
Circuit Boards ◽  
Thermal Transient ◽  
Transient Measurement

This study elucidates the significance of thermal transient measurement based on structure function evaluation particularly on high power LEDs. The metal core printed circuit boards (MCPCBs) were redesigned with reference to the product datasheet. Aluminium nitride was employed as the dielectric material of the MCPCBs and thermal performance of copper and aluminium substrate with different substrate thickness has been reported in this paper. It was observed that the aluminium based MCPCBs performed better heat dissipation compared to the copper based MCPCBs. In addition, when two different thicknesses of the MCPCB substrates were compared, it was observed that the thicker substrate performed a lower thermal resistance compared to the thinner substrate MCPCB. The junction to board thermal resistance was determined using the standard transient dual interface method.

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