Development of fine pitch and high lead count ceramic QFP

Abstract PROMET 6 is produced in three grades: PROMET 6, PROMET 6 SK and PROMET 6 CR. These alloys comprise a series of high-lead tin bronzes, traditionally known as the bearing bronzes. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and compressive strength. It also includes information on corrosion resistance as well as casting, forming, heat treating, machining, and joining. Filing Code: Cu-218. Producer or source: American Crucible Products Company.

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FEDERAL BRONZE 822

Alloy Digest ◽

10.31399/asm.ad.cu0324 ◽

1976 ◽

Vol 25 (12) ◽

Keyword(s):

Fracture Toughness ◽

Compressive Strength ◽

Physical Properties ◽

Surface Treatment ◽

Tensile Properties ◽

Elevated Temperatures ◽

Heat Treating ◽

Copper Base ◽

High Speeds ◽

High Lead

Abstract FEDERAL BRONZE 822 is a copper-base, high-lead bearing bronze with superior resistance to scoring and seizure beyond the endurance and danger limits of ordinary bearing bronzes. It is used in applications involving high speeds, poor lubrication, heat-generating loads, elevated temperatures, dusty and gritty surroundings, or where a liquid other than oil is used as the lubricant. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and compressive strength as well as fracture toughness. It also includes information on casting, heat treating, machining, joining, and surface treatment. Filing Code: Cu-324. Producer or source: Federal Bronze Products Inc..

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Reballing/Rebumping Ultra-Fine Pitch Packages Less Than 0.5 mm Pitch for FA

ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2014p0160 ◽

2014 ◽

Author(s):

Bob Wettermann

Keyword(s):

Solder Joint ◽

Failure Analysis ◽

Joint Strength ◽

Semiconductor Devices ◽

X Ray ◽

Fine Pitch ◽

Manual Methods

Abstract As the pitch and package sizes of semiconductor devices have shrunk and their complexity has increased, the manual methods by which the packages can be re-bumped or reballed for failure analysis have not kept up with this miniaturization. There are some changes in the types of reballing preforms used in these manual methods along with solder excavation techniques required for packages with pitches as fine as 0.3mm. This paper will describe the shortcomings of the previous methods, explain the newer methods and materials and demonstrate their robustness through yield, mechanical solder joint strength and x-ray analysis.

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