Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibration conditions

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium IEMT-95 ◽

10.1109/iemt.1995.540984 ◽

2002 ◽

Author(s):

J.H. Lau

Keyword(s):

Solder Joint ◽

Flip Chip ◽

Ball Grid Array ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array

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Solder joint reliability of plastic ball grid array with solder bumped flip chip

Soldering & Surface Mount Technology ◽

10.1108/09540910010312401 ◽

2000 ◽

Vol 12 (2) ◽

pp. 16-23 ◽

Author(s):

Shi‐Wei Ricky Lee ◽

John H. Lau

Keyword(s):

Solder Joint ◽

Flip Chip ◽

Ball Grid Array ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array

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Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditions

IEEE Transactions on Components Packaging and Manufacturing Technology Part B ◽

10.1109/96.544363 ◽

1996 ◽

Vol 19 (4) ◽

pp. 728-735 ◽

Author(s):

J.H. Lau

Keyword(s):

Solder Joint ◽

Flip Chip ◽

Ball Grid Array ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array

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Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnect

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853326 ◽

2002 ◽

Author(s):

K.-M. Levis ◽

A. Mawer

Keyword(s):

Solder Joint ◽

Ball Grid Array ◽

Lead Free ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array

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Solder joint reliability of plastic ball grid array (PBGA) and bottom-leaded plastic (BLP) assemblies

10.14711/thesis-b622420 ◽

1998 ◽

Author(s):

Xiaowu Zhang

Keyword(s):

Solder Joint ◽

Ball Grid Array ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array

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Solder joint reliability of large plastic ball grid array assemblies under bending, twisting, and vibration conditions

Microelectronics Reliability ◽

10.1016/s0026-2714(97)87783-9 ◽

1997 ◽

Vol 37 (3) ◽

pp. 532

Keyword(s):

Solder Joint ◽

Ball Grid Array ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array

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Design for Plastic Ball Grid Array Solder Joint Reliability

Circuit World ◽

10.1108/03056129710370132 ◽

1997 ◽

Vol 23 (2) ◽

pp. 11-13 ◽

Author(s):

S.‐W.R. Lee ◽

J.H. Lau

Keyword(s):

Solder Joint ◽

Ball Grid Array ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array

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Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages

Circuit World ◽

10.1108/03056129710800080 ◽

1997 ◽

Vol 23 (1) ◽

pp. 16-19 ◽

Author(s):

S.‐W. Lee ◽

J.H. Lau

Keyword(s):

Solder Joint ◽

Ball Grid Array ◽

Substrate Thickness ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

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Experimental evaluation of board level solder joint reliability of plastic ball grid array assemblies with eutectic Pb-Sn and Pb-free solders

10.14711/thesis-b786510 ◽

2003 ◽

Author(s):

Hoi Wai Lui

Keyword(s):

Solder Joint ◽

Experimental Evaluation ◽

Ball Grid Array ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

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Solder joint reliability of cavity‐down plastic ball grid array assemblies

Soldering & Surface Mount Technology ◽

10.1108/09540919810203829 ◽

1998 ◽

Vol 10 (1) ◽

pp. 26-31 ◽

Author(s):

S.‐W. Ricky Lee ◽

John H. Lau

Keyword(s):

Solder Joint ◽

Ball Grid Array ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array

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Solder joint reliability modeling for a 540-I/O plastic ball-grid-array assembly

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) ◽

10.1109/icmcm.1998.670818 ◽

2002 ◽

Author(s):

B. Su ◽

S. Hareb ◽

Y.C. Lee ◽

M.-J. Lii ◽

M.E. Thurston

Keyword(s):

Solder Joint ◽

Ball Grid Array ◽

Solder Joint Reliability ◽

Reliability Modeling ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array

Download Full-text