A high numerical aperture solid immersion lens magneto-optical recording system

1999 ◽  
Author(s):  
A. Chekanov ◽  
M. Birukawa ◽  
Y. Itoh ◽  
T. Suzuki
Keyword(s):  
Numerical Aperture ◽  
Optical Recording ◽  
Recording System ◽  
Solid Immersion Lens ◽  
High Numerical Aperture

A high numerical aperture solid immersion lens magneto-optical recording system

1999 ◽  
Vol 35 (5) ◽  
pp. 3100-3105 ◽  
Author(s):  
A. Chekanov ◽  
M. Birukawa ◽  
Y. Itoh ◽  
T. Suzuki
Keyword(s):  
Numerical Aperture ◽  
Optical Recording ◽  
Recording System ◽  
Solid Immersion Lens ◽  
High Numerical Aperture

Optical recording system using an integrated solid immersion lens

2002 ◽  
Vol 8 (2-3) ◽  
pp. 169-173 ◽  
Author(s):  
T. S. Song ◽  
H.-D. Kwon ◽  
M.-D. Yi ◽  
N.-C. Park ◽  
Y.-P. Park
Keyword(s):  
Optical Recording ◽  
Recording System ◽  
Solid Immersion Lens

Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging

2014 ◽  
Author(s):  
M.S. Wei ◽  
H.B. Chong ◽  
S.H. Lim ◽  
C. Richardson
Keyword(s):  
Sample Preparation ◽  
Focal Length ◽  
Numerical Aperture ◽  
Fault Isolation ◽  
Numerical Control ◽  
Thickness Variation ◽  
Solid Immersion Lens ◽  
Laser Imaging ◽  
High Numerical Aperture ◽  
Silicon Thickness

Abstract High resolution laser imaging, using high numerical aperture (NA) solid immersion lens (SIL) for backside fault isolation imposes stringent sample preparation requirements; as a result of the short focal length of SIL, a die must be thinned to a targeted thickness with less than a ±5 μm silicon thickness variation across the entire die. Flip chip packaged dice suffer from warpage due to various package sizes and substrate thicknesses. Such broad spectrums of part geometries pose a great challenge to meet such silicon planarity requirements. As relaxation of the packaged silicon during polishing causes the warpage profile to change dynamically and unpredictably throughout the thinning process, it has become an added challenge to meet the stringent sample preparation requirements. To overcome the stochastic nature of this problem, a two-step polishing recipe consisting of computer numerical control (CNC) mechanical milling and polishing processes has been developed to achieve sufficient silicon thickness uniformity to enable SIL imaging across an entire silicon chip as large as approximately 20 mm x 15 mm.

Optical Recording Using High Numerical-Aperture Microlens by Plasma Etching

2002 ◽  
Vol 41 (Part 1, No. 3B) ◽  
pp. 1825-1828 ◽  
Author(s):  
Akira Kouchiyama ◽  
Isao Ichimura ◽  
Koichiro Kishima ◽  
Takashi Nakao ◽  
Kenji Yamamoto ◽  
...  
Keyword(s):  
Plasma Etching ◽  
Numerical Aperture ◽  
Optical Recording ◽  
High Numerical Aperture

Realization of an active-tilt-controlled high-numerical-aperture two-lens objective for optical recording

1999 ◽  
Author(s):  
Jan P. Baartman ◽  
Benno H. W. Hendriks ◽  
Jan W. Aarts ◽  
Gerard E. van Rosmalen
Keyword(s):  
Numerical Aperture ◽  
Optical Recording ◽  
High Numerical Aperture

Miniaturised High-Numerical Aperture Singlet Plastic Objective for Optical Recording

2005 ◽  
Vol 44 (9A) ◽  
pp. 6564-6567 ◽  
Author(s):  
B. H. W. Hendriks ◽  
M. A. J. van As ◽  
A. A. M. van Alem
Keyword(s):  
Numerical Aperture ◽  
Optical Recording ◽  
High Numerical Aperture
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