2.5D Package Modelling for Short Circuit Failure Analysis by High-Resolution Time-domain Reflectometry

Author(s):  
Yang Shang ◽  
Makoto Shinohara ◽  
Wen Qiu ◽  
Bernice Zee
Soil Science ◽  
1995 ◽  
Vol 159 (3) ◽  
pp. 149-154 ◽  
Author(s):  
L. W. PETERSEN ◽  
A. THOMSEN ◽  
P. MOLDRUP ◽  
O. H. JACOBSEN ◽  
D. E. ROLSTON

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