2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications

TOTAL DOCUMENTS

146

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H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781538649299

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Study of the Cluster Ion for Gate Oxide Nitrogen Measurement by TOF-SIMS

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452579 ◽

2018 ◽

Cited By ~ 1

Author(s):

Han Wei Teo ◽

Yun Wang ◽

Zhi Qiang Mo

Keyword(s):

Gate Oxide ◽

Tof Sims ◽

Cluster Ion

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Failure Analysis Methodology on Systematic MIM failure in Wafer Fabrication

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452519 ◽

2018 ◽

Cited By ~ 1

Author(s):

Angela Teo ◽

Ang Ghim Boon ◽

Ng Hui Peng ◽

Chen Chang Qing ◽

Xu Nai Yun ◽

...

Keyword(s):

Failure Analysis ◽

Wafer Fabrication ◽

Analysis Methodology

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Copper Wire Bond Optimization for Power Devices

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452561 ◽

2018 ◽

Author(s):

T. Pinili ◽

R. Watkins ◽

W. Qin ◽

G. Brizar ◽

J. De Clerq ◽

...

Keyword(s):

Copper Wire ◽

Power Devices ◽

Wire Bond

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Nano C-V imaging of Semiconductor Devices with Scanning Microwave Impedance Microscopy

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452492 ◽

2018 ◽

Author(s):

Oskar Amster ◽

Kurt Rubin ◽

Yongliang Yang ◽

Dorai Iyer ◽

A. Messinger ◽

...

Keyword(s):

Semiconductor Devices

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IPFA 2018 Technical Program

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452555 ◽

2018 ◽

Keyword(s):

Technical Program

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Characterization of Flakes on Copper Bond Pad after Flux Cleaning Process

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452611 ◽

2018 ◽

Author(s):

Lee Chai Ying ◽

Walter Juerzen ◽

Cheong Choke Fei

Keyword(s):

Cleaning Process

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BEOL Reliability for More- Than-Moore Devices

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452508 ◽

2018 ◽

Author(s):

Jeff Gambino

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Failure Analysis Case Studies on Wafer Edge Failure due to Process Uniformity Issue

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452549 ◽

2018 ◽

Author(s):

N.Y. Xu ◽

H.P. Ng ◽

G.B. Ang ◽

C.Q. Chen ◽

A. Teo ◽

...

Keyword(s):

Failure Analysis ◽

Case Studies ◽

Process Uniformity ◽

Edge Failure ◽

Wafer Edge

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Hot Carrier Stress Investigation of Zinc Oxide Thin Film Transistors with an Al2O3 Gate Dielectric

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452171 ◽

2018 ◽

Cited By ~ 3

Author(s):

Rodolfo A. Rodriguez-Davila ◽

Israel Mejia ◽

Manuel Quevedo-Lopez ◽

Chadwin D. Young

Keyword(s):

Thin Film ◽

Zinc Oxide ◽

Thin Film Transistors ◽

Gate Dielectric ◽

Oxide Thin Film ◽

Zinc Oxide Thin Film ◽

Hot Carrier ◽

Hot Carrier Stress ◽

Al2o3 Gate Dielectric

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Influence of Design Considerations on Hot Carrier Injection Degradation of STI-based LDMOS Transistors

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452504 ◽

2018 ◽

Cited By ~ 3

Author(s):

A. F. M. Alimin ◽

S. F. W. M. Hatta ◽

N. Soin

Keyword(s):

Carrier Injection ◽

Hot Carrier ◽

Design Considerations ◽

Hot Carrier Injection

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2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Study of the Cluster Ion for Gate Oxide Nitrogen Measurement by TOF-SIMS

Failure Analysis Methodology on Systematic MIM failure in Wafer Fabrication

Copper Wire Bond Optimization for Power Devices

Nano C-V imaging of Semiconductor Devices with Scanning Microwave Impedance Microscopy

IPFA 2018 Technical Program

Characterization of Flakes on Copper Bond Pad after Flux Cleaning Process

BEOL Reliability for More- Than-Moore Devices

Failure Analysis Case Studies on Wafer Edge Failure due to Process Uniformity Issue

Hot Carrier Stress Investigation of Zinc Oxide Thin Film Transistors with an Al2O3 Gate Dielectric

Influence of Design Considerations on Hot Carrier Injection Degradation of STI-based LDMOS Transistors

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications