2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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146

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3

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9781538649299

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Sample Preparation Methodology for a CMOS+MEMS Device with Low Frequency and Seal Ring Short Failures

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452539 ◽

2018 ◽

Author(s):

Sharon Lee ◽

Leyhong Khoo ◽

Lihong Li ◽

Pohchuan Ang ◽

Zhiqiang Mo

Keyword(s):

Sample Preparation ◽

Low Frequency ◽

Seal Ring ◽

Cmos Mems ◽

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New HTDR Phenomenon Study for 2Xnm NAND Flash Cycling Interval Time Effect

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452599 ◽

2018 ◽

Author(s):

Huang Chia-Sheng ◽

Ryoichi Ogino

Keyword(s):

Time Effect ◽

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Contactless Fault Isolation of Ultra Low k Dielectrics in Soft Breakdown Condition

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452487 ◽

2018 ◽

Author(s):

N. Herfurth ◽

C. Wu ◽

T. Nakamura ◽

I.De Wolf ◽

K. Croes ◽

...

Keyword(s):

Fault Isolation ◽

Soft Breakdown ◽

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Quantitative Evaluation of Carrier Distribution in Silicon Solar Cell Using Scanning Nonlinear Dielectric Microscopy

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452172 ◽

2018 ◽

Author(s):

Kotaro Hirose ◽

Katsuto Tanahashi ◽

Hidetaka Takato ◽

Yasuo Cho

Keyword(s):

Quantitative Evaluation ◽

Silicon Solar Cell ◽

Carrier Distribution ◽

Nonlinear Dielectric

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Reliability Assessment of 10nm FinFET Process Technology

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452491 ◽

2018 ◽

Author(s):

Jin Ju Kim ◽

Minjung Jin ◽

Hyunchul Sagong ◽

Sangwoo Pae

Keyword(s):

Reliability Assessment ◽

Process Technology

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New Laser Voltage Signal Insights from EOFM Simulations and Measurements on different pn-junctions

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452174 ◽

2018 ◽

Author(s):

I. Vogt ◽

R. Leihkauf ◽

T. Nakamura ◽

C. Boit

Keyword(s):

Voltage Signal ◽

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Theoretical Study of Ag Interactions in Amorphous Silica RRAM Devices

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452536 ◽

2018 ◽

Author(s):

K. Patel ◽

J. Cottom ◽

M. Bosman ◽

A. J. Kenyon ◽

A. L. Shluger

Keyword(s):

Amorphous Silica ◽

Theoretical Study

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Study of the Cluster Ion for Gate Oxide Nitrogen Measurement by TOF-SIMS

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452579 ◽

2018 ◽

Author(s):

Han Wei Teo ◽

Yun Wang ◽

Zhi Qiang Mo

Keyword(s):

Tof Sims ◽

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Failure Analysis Methodology on Systematic MIM failure in Wafer Fabrication

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452519 ◽

2018 ◽

Author(s):

Angela Teo ◽

Ang Ghim Boon ◽

Ng Hui Peng ◽

Chen Chang Qing ◽

Xu Nai Yun ◽

...

Keyword(s):

Failure Analysis ◽

Wafer Fabrication ◽

Analysis Methodology

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Copper Wire Bond Optimization for Power Devices

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2018.8452561 ◽

2018 ◽

Author(s):

T. Pinili ◽

R. Watkins ◽

W. Qin ◽

G. Brizar ◽

J. De Clerq ◽

...

Keyword(s):

Copper Wire ◽

Power Devices ◽

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