A 2.4GHz ULP OOK single-chip transceiver for healthcare applications

Author(s):  
Maja Vidojkovic ◽  
Xiongchuan Huang ◽  
Pieter Harpe ◽  
Simonetta Rampu ◽  
Cui Zhou ◽  
...  
2011 ◽  
Vol 5 (6) ◽  
pp. 523-534 ◽  
Author(s):  
Maja Vidojkovic ◽  
Xiongchuan Huang ◽  
Pieter Harpe ◽  
Simonetta Rampu ◽  
Cui Zhou ◽  
...  

2021 ◽  
Vol 7 (2) ◽  
pp. 37-40
Author(s):  
Stephan Göb ◽  
Theresa Ida Götz ◽  
Thomas Wittenberg

Abstract Multispectral imaging devices incorporating up to 256 different spectral channels have recently become available for various healthcare applications, as e.g. laparoscopy, gastroscopy, dermatology or perfusion imaging for wound analysis. Currently, the use of such devices is limited due to very high investment costs and slow capture times. To compensate these shortcomings, single sensors with spectral masking on the pixel level have been proposed. Hence, adequate spectral reconstruction methods are needed. Within this work, two deep convolutional neural networks (DCNN) architectures for spectral image reconstruction from single sensors are compared with each other. Training of the networks is based on a huge collection of different MSI imagestacks, which have been subsampled, simulating 16-channel single sensors with spectral masking. We define a training, validation and test set (‘HITgoC’) resulting in 351 training (631.128 sub-images), 99 validation (163.272 sub-images) and 51 test images. For the application in the field of neurosurgery an additional testing set of 36 image stacks from the Nimbus data collection is used, depicting MSI brain data during open surgery. Two DCNN architectures were compared to bilinear interpolation (BI) and an intensity difference (ID) algorithm. The DCNNs (ResNet-Shinoda) were trained on HITgoC and consist of a preprocessing step using BI or ID and a refinement part using a ResNet structure. Similarity measures used were PSNR, SSIM and MSE between predicted and reference images. We calculated the similarity measures for HitgoC and Nimbus data and determined differences of the mean similarity measure values achieved with the ResNet-ID and baseline algorithms such as BI algorithm and ResNet-Shinoda. The proposed method achieved better results against BI in SSIM (.0644 vs. .0252), PSNR (15.3 dB vs. 9.1 dB) and 1-MSE*100 (.0855 vs. .0273) and compared to ResNet-Shinoda in SSIM (.0103 vs. .0074), PSNR (3.8 dB vs. 3.6 dB) and 1-MSE*100 (.0075 vs. .0047) for HITgoC/Nimbus. In this study, significantly better results for spectral reconstruction in MSI images of open neurosurgery was achieved using a combination of ID-interpolation and ResNet structure compared to standard methods.


MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 19-27 ◽  
Author(s):  
Wei William Lee ◽  
Paul S. Ho

Continuing improvement of microprocessor performance historically involves a decrease in the device size. This allows greater device speed, an increase in device packing density, and an increase in the number of functions that can reside on a single chip. However higher packing density requires a much larger increase in the number of interconnects. This has led to an increase in the number of wiring levels and a reduction in the wiring pitch (sum of the metal line width and the spacing between the metal lines) to increase the wiring density. The problem with this approach is that—as device dimensions shrink to less than 0.25 μm (transistor gate length)—propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant due to increased wiring capacitance, especially interline capacitance between the metal lines on the same metal level. The smaller line dimensions increase the resistivity (R) of the metal lines, and the narrower interline spacing increases the capacitance (C) between the lines. Thus although the speed of the device will increase as the feature size decreases, the interconnect delay becomes the major fraction of the total delay and limits improvement in device performance.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILD) as well as alternative architectures have been proposed to replace the current Al(Cu) and SiO2 interconnect technology.


2020 ◽  
Vol 2 (2) ◽  
Author(s):  
Suzanna Schmeelk ◽  
Lixin Tao

Many organizations, to save costs, are movinheg to t Bring Your Own Mobile Device (BYOD) model and adopting applications built by third-parties at an unprecedented rate.  Our research examines software assurance methodologies specifically focusing on security analysis coverage of the program analysis for mobile malware detection, mitigation, and prevention.  This research focuses on secure software development of Android applications by developing knowledge graphs for threats reported by the Open Web Application Security Project (OWASP).  OWASP maintains lists of the top ten security threats to web and mobile applications.  We develop knowledge graphs based on the two most recent top ten threat years and show how the knowledge graph relationships can be discovered in mobile application source code.  We analyze 200+ healthcare applications from GitHub to gain an understanding of their software assurance of their developed software for one of the OWASP top ten moble threats, the threat of “Insecure Data Storage.”  We find that many of the applications are storing personally identifying information (PII) in potentially vulnerable places leaving users exposed to higher risks for the loss of their sensitive data.


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