crosstalk noise
Recently Published Documents


TOTAL DOCUMENTS

332
(FIVE YEARS 43)

H-INDEX

24
(FIVE YEARS 3)

Micromachines ◽  
2021 ◽  
Vol 12 (12) ◽  
pp. 1438
Author(s):  
Yuehong Yang ◽  
Ye Su ◽  
Bocheng Liu ◽  
Junxiong Chai ◽  
Li Dai ◽  
...  

Optical network-on-chip (ONoC) is based on optical interconnects and optical routers (ORs), which have obvious advantages in bandwidth and power consumption. Transmission capacity is a significant performance in ONoC architecture, which has to be fully considered during the design process. Relying on mode-division multiplexing (MDM) technology, the system capacity of optical interconnection is greatly improved compared to the traditional multiplexing technology. With the explosion in MDM technology, the optical router supporting MDM came into being. In this paper, we design a multimode optical router (MDM-OR) model and analyze its indicators. Above all, we propose a novel multimode switching element and design an N-port universal multimode optical router (MDM-OR) model. Secondly, we analyze the insertion loss model of different optical devices and the crosstalk noise model of N-port MDM-OR. On this basis, a multimode router structure of a single-mode five-port optical router is proposed. At the same time, we analyze the transmission loss, crosstalk noise, signal-to-noise radio (OSNR), and bit error rate (BER) of different input–output pairs by inputting the 1550 nm TE0, TE1, and TE2 modes to the router.


2021 ◽  
Vol 2021 ◽  
pp. 1-15
Author(s):  
Meaad Fadhel ◽  
Lei Huang ◽  
Huaxi Gu

High-speed data transmission enabled by photonic network-on-chip (PNoC) has been regarded as a significant technology to overcome the power and bandwidth constraints of electrical network-on-Chip (ENoC). This has given rise to an exciting new research area, which has piqued the public’s attention. Current on-chip architectures cannot guarantee the reliability of PNoC, due to component failures or breakdowns occurring, mainly, in active components such as optical routers (ORs). When such faults manifest, the optical router will not function properly, and the whole network will ultimately collapse. Moreover, essential phenomena such as insertion loss, crosstalk noise, and optical signal-to-noise ratio (OSNR) must be considered to provide fault-tolerant PNoC architectures with low-power consumption. The main purpose of this manuscript is to improve the reliability of PNoCs without exposing the network to further blocking or contention by taking the effect of backup paths on signals sent over the default paths into consideration. Thus, we propose a universal method that can be applied to any optical router in order to increase the reliability by using a reliable ring waveguide (RRW) to provide backup paths for each transmitted signal within the same router, without the need to change the route of the signal within the network. Moreover, we proposed a simultaneous transmission probability analysis for optical routers to show the feasibility of this proposed method. This probability analyzes all the possible signals that can be transmitted at the same time within the default and the backup paths of the router. Our research work shows that the simultaneous transmission probability is improved by 10% to 46% compared to other fault-tolerant optical routers. Furthermore, the worst-case insertion loss of our scheme can be reduced by 46.34% compared to others. The worst-case crosstalk noise is also reduced by 24.55%, at least, for the default path and 15.7%, at least, for the backup path. Finally, in the network level, the OSNR is increased by an average of 68.5% for the default path and an average of 15.9% for the backup path, for different sizes of the network.


Electronics ◽  
2021 ◽  
Vol 10 (13) ◽  
pp. 1590
Author(s):  
Kyunghwan Song ◽  
Jongwook Kim ◽  
Hyunwoong Kim ◽  
Seonghi Lee ◽  
Jangyong Ahn ◽  
...  

It is necessary to reduce the crosstalk noise in high-speed signaling channels. In the channel routing area, the tabbed routing pattern is used to mitigate far-end crosstalk (FEXT), and the electrical length is controlled with a time domain reflectometer (TDR) and time domain transmission (TDT). However, unlike traditional channels having uniform width and space, the width and space of tabbed routing changes by segment, and the capacitance and inductance values of tabbed routing also change. In this paper, we propose a tabbed routing equivalent circuit modeling method using the segmentation approach. The proposed model was verified using 3D EM simulation and measurement results in the frequency domain. Based on the calculated inductance and capacitance parameters, we analyzed the insertion loss, FEXT, and self-impedance in the frequency domain, and TDT and FEXT in the time domain, by comparing the values of these metrics with and without tabbed routing. Using the proposed tabbed routing model, we analyzed tabbed routing with variations of design parameters based on self- and mutual-capacitance and inductance.


2021 ◽  
Author(s):  
Bhaskar Gugulothu ◽  
Rajendra Naik Bhukya

Abstract In this paper, the Crosstalk noise analysis of coupled on-chip interconnects have been analyzed. The multiresolution time-domain method (MRTD) is used to analyze the crosstalk noise model. The crosstalk induced propagation time delay and crosstalk peak voltage on the victim line of interconnects have been determined and compared to those of the conventional finite difference time domain (FDTD) method and validated with HSPICE simulations at the 22nm technology node. The results of the proposed method shows that crosstalk induced propagation delay in dynamic in-phase, out-phase and peak voltage timing, as well as the peak voltage value for functional crosstalk in the copper interconnects are an average error of less than 0.53% for the proposed model and HSPICE simulations. The results of the proposed model are closely similar to those of HSPICE simulations. Electromagnetic interference and electromagnetic compatibility of on-chip interconnects can also be addressed using the proposed method.


Author(s):  
Swati Gupta ◽  
Anil Gaikwad ◽  
Ashok Mahajan ◽  
Lin Hongxiao ◽  
He Zhewei

Low dielectric constant (Low-[Formula: see text]) films are used as inter layer dielectric (ILD) in nanoelectronic devices to reduce interconnect delay, crosstalk noise and power consumption. Tailoring capability of porous low-[Formula: see text] films attracted more attention. Present work investigates comparative study of xerogel, aerogel and porogen based porous low-[Formula: see text] films. Deposition of SiO2 and incorporation of less polar bonds in film matrix is confirmed using Fourier Transform Infra-Red Spectroscopy (FTIR). Refractive indices (RI) of xerogel, aerogel and porogen based low-[Formula: see text] films observed to be as low as 1.25, 1.19 and 1.14, respectively. Higher porosity percentage of 69.46% is observed for porogen-based films while for shrinked xerogel films, it is lowered to 45.47%. Porous structure of low-[Formula: see text] films has been validated by using Field Emission Scanning Electron Microscopy (FE-SEM). The pore diameters of porogen based annealed samples were in the range of 3.53–25.50 nm. The dielectric constant ([Formula: see text]) obtained from RI for xerogel, aerogel and porogen based films are 2.58, 2.20 and 1.88, respectively.


2021 ◽  
Vol 17 (4) ◽  
pp. e1008887
Author(s):  
Alex Baranski ◽  
Idan Milo ◽  
Shirley Greenbaum ◽  
John-Paul Oliveria ◽  
Dunja Mrdjen ◽  
...  

Mass Based Imaging (MBI) technologies such as Multiplexed Ion Beam Imaging by time of flight (MIBI-TOF) and Imaging Mass Cytometry (IMC) allow for the simultaneous measurement of the expression levels of 40 or more proteins in biological tissue, providing insight into cellular phenotypes and organization in situ. Imaging artifacts, resulting from the sample, assay or instrumentation complicate downstream analyses and require correction by domain experts. Here, we present MBI Analysis User Interface (MAUI), a series of graphical user interfaces that facilitate this data pre-processing, including the removal of channel crosstalk, noise and antibody aggregates. Our software streamlines these steps and accelerates processing by enabling real-time and interactive parameter tuning across multiple images.


2021 ◽  
Vol 16 (3) ◽  
pp. 494-500
Author(s):  
Zhen-Song Li ◽  
Bing-Jie Li ◽  
Min Miao

Through silicon via (TSV) is the key technology for the vertical interconnect in three-dimensional integrated circuits (3-D ICs). With the help of TSVs, higher throughput in signal transmission can be attained. However, the tightly clustered TSVs in the TSV array suffer from crosstalk noise, a situation which results in transmission errors. This study investigates, the channel model of the TSV array, involving main factors affecting transmission performance, such as transmission loss, inter-channel interference, and crosstalk noise with different digital patterns. A parallel transmission scheme based on a turbo product code (TPC) parallel coding is proposed. In this scheme, the binary bits of information are reshaped into two dimensional blocks. Each block is parallel encoded using a TPC into a codeword block for parallel transmission through the TSV array channel. At the receiver, the sending information is reformed by a concurrent hard decision decoding algorithm of a TPC. This parallel transmission scheme achieves low bit-error-rate, high throughput, and a lower system overhead relative to that of its ground TSV shielded counterpart if the type of TPC is carefully selected. The simulation results confirm that this scheme reduces inter-symbol interference, minimizes structural defects in the TSV array, and improves transmission performance in 3-D ICs.


Sign in / Sign up

Export Citation Format

Share Document