Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating

2006 ◽  
Author(s):  
Kejun Zeng ◽  
R. Stierman ◽  
D. Abbott ◽  
M. Murtuza
Keyword(s):  
Solder Joints ◽  
Electroless Nickel ◽  
Gold Plating ◽  
Root Cause ◽  
Electroless Nickel Immersion Gold ◽  
Black Pad

The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating

JOM ◽  
2006 ◽  
Vol 58 (6) ◽  
pp. 75-79 ◽  
Author(s):  
Kejun Zeng ◽  
Roger Stierman ◽  
Don Abbott ◽  
Masood Murtuza
Keyword(s):  
Solder Joints ◽  
Gold Plating ◽  
Root Cause ◽  
Black Pad ◽  
Electroless Ni

Corrosion behavior of electroless nickel/immersion gold plating by interfacial morphology

2015 ◽  
Vol 11 (4) ◽  
pp. 695-701 ◽  
Author(s):  
Dong-Jun Lee ◽  
Seok-Hwan Huh ◽  
Chi-Seong Kim ◽  
Seongjae Mun ◽  
Han-Kyun Shin ◽  
...  
Keyword(s):  
Corrosion Behavior ◽  
Electroless Nickel ◽  
Gold Plating ◽  
Interfacial Morphology ◽  
Electroless Nickel Immersion Gold

scholarly journals Effect of Electroless Nickel/Immersion Gold Finishing on BGA Solder Joints.

2001 ◽  
Vol 4 (2) ◽  
pp. 124-127 ◽  
Author(s):  
Takashi SUGIZAKI ◽  
Kazutaka TAJIMA ◽  
Tadashi SASAKI ◽  
Hidehiro NAKAO ◽  
Yutaka FUKUDA ◽  
...  
Keyword(s):  
Solder Joints ◽  
Electroless Nickel ◽  
Electroless Nickel Immersion Gold

scholarly journals Erratum to: Corrosion behavior of electroless nickel/immersion gold plating by interfacial morphology

2015 ◽  
Vol 11 (5) ◽  
pp. 915-915
Author(s):  
Dong-Jun Lee ◽  
Seok-Hwan Huh ◽  
Chi-Seong Kim ◽  
Seongjae Mun ◽  
Han-Kyun Shin ◽  
...  
Keyword(s):  
Corrosion Behavior ◽  
Electroless Nickel ◽  
Gold Plating ◽  
Interfacial Morphology ◽  
Electroless Nickel Immersion Gold
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