Discoloration related failure mechanism and its root cause in electroless nickel immersion gold (ENIG) pad metallurgical surface finish

Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA 2004 (IEEE Cat No 04TH8743) IPFA-04 ◽

10.1109/ipfa.2004.1345605 ◽

2004 ◽

Author(s):

Chong Kam Meng ◽

T.S. Selvamuniandy ◽

C. Gurumurthy

Keyword(s):

Failure Mechanism ◽

Surface Finish ◽

Electroless Nickel ◽

Root Cause ◽

Electroless Nickel Immersion Gold

Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008179 ◽

2002 ◽

Cited By ~ 33

Author(s):

D. Goyal ◽

T. Lane ◽

P. Kinzie ◽

C. Panichas ◽

Kam Meng Chong ◽

...

Keyword(s):

Solder Joint ◽

Failure Mechanism ◽

Electroless Nickel ◽

Electroless Nickel Immersion Gold ◽

Joint Fracture

Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold Surface Finish

Journal of Electronic Materials ◽

10.1007/s11664-011-1682-1 ◽

2011 ◽

Vol 40 (9) ◽

pp. 1937-1942 ◽

Cited By ~ 9

Author(s):

Q. V. Bui ◽

N. D. Nam ◽

J. W. Yoon ◽

D. H. Choi ◽

A. Kar ◽

...

Keyword(s):

Corrosion Behavior ◽

Surface Finish ◽

Electroless Nickel ◽

Gold Surface ◽

Electroless Nickel Immersion Gold

Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. ◽

10.1109/itherm.2006.1645469 ◽

2006 ◽

Cited By ~ 4

Author(s):

Kejun Zeng ◽

R. Stierman ◽

D. Abbott ◽

M. Murtuza

Keyword(s):

Solder Joints ◽

Electroless Nickel ◽

Gold Plating ◽

Root Cause ◽

Electroless Nickel Immersion Gold ◽

Black Pad

Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with electroless nickel immersion gold (ENIG) surface finish

2007 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2007.4510317 ◽

2007 ◽

Cited By ~ 2

Author(s):

Yong-Sung Park ◽

Yong-Min Kwon ◽

Ho-Young Son ◽

Jeong-Tak Moon ◽

Byung-Wook Jeong ◽

...

Keyword(s):

Surface Finish ◽

Electroless Nickel ◽

Drop Test ◽

Test Reliability ◽

Electroless Nickel Immersion Gold ◽

Bga Packages ◽

Solder Balls

Microstructure evolution of Sn-Cu based solder paste on electroless nickel immersion gold (ENIG) surface finish subjected to multiple reflow cycles

10.1063/5.0051918 ◽

2021 ◽

Author(s):

Rita Mohd Said ◽

Muhammad Alif Haikal Abdul Ghani ◽

Norainiza Saud ◽

Mohd Arif Anuar Mohd Salleh

Keyword(s):

Microstructure Evolution ◽

Surface Finish ◽

Electroless Nickel ◽

Solder Paste ◽

Electroless Nickel Immersion Gold ◽

Multiple Reflow Cycles

The pH effect on black spots in surface finish: Electroless nickel immersion gold

Applied Surface Science ◽

10.1016/j.apsusc.2010.06.033 ◽

2010 ◽

Vol 257 (1) ◽

pp. 56-61 ◽

Cited By ~ 25

Author(s):

Yong Sun Won ◽

Sung Soo Park ◽

Jinuk Lee ◽

Jong-Yun Kim ◽

Seong-Jae Lee

Keyword(s):

Surface Finish ◽

Ph Effect ◽

Electroless Nickel ◽

Electroless Nickel Immersion Gold ◽

Black Spots

Thermal stability of electroless nickel/immersion gold surface finish for direct bond copper

Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) ◽

10.1109/estc.2014.6962845 ◽

2014 ◽

Author(s):

Min-Su Kim ◽

Hiroshi Nishikawa

Keyword(s):

Thermal Stability ◽

Surface Finish ◽

Electroless Nickel ◽

Gold Surface ◽

Direct Bond ◽

Electroless Nickel Immersion Gold ◽

Direct Bond Copper ◽

Thermal Stability Of

The investigation of the correlation between electroless nickel immersion gold and high-speed signal transmission (IMPACT 2020)

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268595 ◽

2020 ◽

Author(s):

Ian Yi-En Su ◽

Chih-Hao Huang ◽

Chris Hansen ◽

Yu-Shyan Lin

Keyword(s):

High Speed ◽

Signal Transmission ◽

Electroless Nickel ◽

Electroless Nickel Immersion Gold

Effect of phosphorus content and solid state aging on intermetallic formation between lead-free Sn-Ag-Cu solder and electroless nickel/immersion gold under bump metallurgy

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188848 ◽

2003 ◽

Cited By ~ 1

Author(s):

S.F. Tai ◽

A. Ourdjini ◽

Y.L. Khong ◽

V.C. Venkatesh ◽

M.N. Tamin

Keyword(s):

Solid State ◽

Phosphorus Content ◽

Electroless Nickel ◽

Lead Free ◽

Intermetallic Formation ◽

Electroless Nickel Immersion Gold

Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ◽

10.1007/978-0-85729-236-0_8 ◽

2011 ◽

pp. 179-195 ◽

Cited By ~ 1

Author(s):

P.-E. Tegehall

Keyword(s):

Solder Joints ◽

Electroless Nickel ◽

Electroless Nickel Immersion Gold ◽

Black Pad ◽

Intermetallic Layers