Multi objective optimization of BEoL and fBEOL structure in flip chip package during die attach process

Author(s):  
Hardik Parekh ◽  
Fahad Mirza ◽  
Dereje Agonafer
2017 ◽  
Vol 10 (5) ◽  
pp. 371
Author(s):  
Arakil Chentoufi ◽  
Abdelhakim El Fatmi ◽  
Molay Ali Bekri ◽  
Said Benhlima ◽  
Mohamed Sabbane

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